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CD74HC7266M96G4

Texas Instruments

CD74HC7266M96G4 by Texas Instruments

CD74HC7266M96G4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 35 ns at 4.5V, making it suitable for high-speed applications. This CMOS technology device operates in temperatures ranging from -55 to 125°C, ideal for military-grade electronics.

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1k+

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Vyrian

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Digiode

USA . 845 parts In-Stock

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Native Components

USA . 294 parts In-Stock

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$1.425

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Northwest PG Solutions

USA . 823 parts In-Stock

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$1.567

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AZTECH Wire

Italy . 391 parts In-Stock

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$13.196

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Parana Technologies

USA . 22 parts In-Stock

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$14.072

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$1,306.779

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$12.665

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DigiPath Technology Company

USA . 1,509 parts In-Stock

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$15.495

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$14.255

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ChromeModa Solutions

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IDEA Electronic Components Group

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One Stop Electronics

USA . 504 parts In-Stock

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Component Stockers USA

USA . 299 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

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Overview

Enhance your electronic projects with the CD74HC7266M96G4 by Texas Instruments, a top-tier logic gate solution that guarantees high-quality performance and reliability. With a maximum propagation delay of just 35 ns and four functions packed into one small outline package, this versatile component is perfect for a wide range of applications. Whether you're working on robotics, automation, or consumer electronics, this product offers unparalleled value, efficiency, and ease of use. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internals of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 35 ns

The low propagation delay ensures fast operation and response times in the circuit, making the product efficient.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, reducing assembly time and cost.

No. of Functions: 4

Having multiple functions in one component saves space on the circuit board and simplifies the overall design.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage allows compatibility with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures proper functioning and stability of the logic gates in various circuit configurations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the product suitable for a wide range of environments and conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the product can function reliably even in cold environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates CD74HC7266M96G4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC7266M96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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