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CD74HC125M96E4

Texas Instruments

CD74HC125M96E4 by Texas Instruments

CD74HC125M96E4 by Texas Instruments is a 4-function bus driver with 30ns propagation delay, operating at a supply voltage range of 2-6V. It features a small outline package style, true output polarity, and 3-state output characteristics. Ideal for applications requiring fast signal transmission in military-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,196 parts In-Stock

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Digiode

USA . 4,571 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Andel Nordic

Denmark . 2,152 parts In-Stock

1+ parts

$7.734

100+ parts

-

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$7.425

10k+ parts

$7.425

2,152

$7.734

-

$7.425

$7.425

AZTECH Wire

Italy . 364 parts In-Stock

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$10.257

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364

$10.257

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Parana Technologies

USA . 1,279 parts In-Stock

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$21.074

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$21.327

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$21.074

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$21.327

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DigiPath Technology Company

USA . 1,561 parts In-Stock

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$23.205

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$23.205

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ChromeModa Solutions

Germany . 1,230 parts In-Stock

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$23.679

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$19.417

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$23.679

$19.417

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IDEA Electronic Components Group

UK . 1,225 parts In-Stock

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$23.679

100+ parts

$22.495

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$21.311

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$23.679

$22.495

$21.311

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Corohmni

South Africa . 62 parts In-Stock

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$24.311

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62

$24.311

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One Stop Electronics

USA . 1,310 parts In-Stock

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$37.000

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$37.000

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Ampacity Inc.

Singapore . 1,080 parts In-Stock

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$62.000

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$62.000

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Component Stockers USA

USA . 689 parts In-Stock

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$99.990

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Microchip USA

USA . 4,848 parts In-Stock

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Continental Prestige Electronics

USA . 4,345 parts In-Stock

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Argo Parts USA

USA . 2,452 parts In-Stock

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Corphita

USA . 2,196 parts In-Stock

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Bastille Electronics

Australia . 70 parts In-Stock

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Overview

Experience superior performance and reliability with the CD74HC125M96E4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Bus Driver & Transceivers that are perfect for a wide range of applications. This product offers exceptional value with its fast propagation delay and low power consumption, making it an ideal choice for your electronic projects. Trust in Texas Instruments to provide you with innovative solutions that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 30 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and facilitating mass production.

No. of Functions: 4

Having multiple functions in a single device simplifies circuit design and reduces the need for additional components.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V ensures compatibility with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance allows for efficient signal transmission and reception without distortion.

Power Supplies (V): 2/6

Support for multiple power supply voltages enables flexibility in system integration and compatibility with various power sources.

No. of Terminals: 14

Having a sufficient number of terminals allows for easy connection and interfacing with other components.

Maximum I (ol): 6 Amp

High output current capability makes this product suitable for driving heavy loads or high-power applications.

Propagation Delay (tpd): 150 ns

Moderate propagation delay ensures reliable signal transmission without significant delays.

Output Characteristics: 3-STATE

3-STATE output allows for tri-state logic operation, enabling flexible control of output signals.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes this product suitable for extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term reliability.

No. of Ports: 2

Multiple ports enable versatile connectivity and data exchange with external devices.

Length: 8.65 mm

Compact size facilitates space-saving installation in tight layouts or densely populated PCBs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and signal integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering during assembly processes.

Temperature Grade: MILITARY

Military-grade temperature rating guarantees performance and reliability under harsh operating conditions.

Terminal Form: GULL WING

Gull wing terminals provide sturdy mechanical support and enhance solder joint reliability.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB layout and assembly, ensuring compatibility with common design practices.

Maximum Power Supply Current (ICC): 0.16 mA

Low power supply current consumption minimizes energy usage and heat dissipation, ideal for battery-powered devices or energy-efficient applications.

Technical Specifications

Bus Driver & Transceivers CD74HC125M96E4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC125M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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