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CD74HC125M96

Texas Instruments

CD74HC125M96 by Texas Instruments

CD74HC125M96 by Texas Instruments is a 4-bit bus driver & transceiver with a propagation delay of 30 ns and a load capacitance of 50 pF. It is commonly used in applications requiring true output polarity and a small outline package style.

Median Price

$0.208

Lifecycle Status

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20

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1k+

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Arrow

USA . 1,459 parts In-Stock

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Chip1Stop

Japan . 11,648 parts In-Stock

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Texas Instruments

USA . 298,570 parts In-Stock

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Adafruit Industries

USA . 40 parts In-Stock

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DigiKey

USA . 7,448 parts In-Stock

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Mouser Electronics

USA . 1,158 parts In-Stock

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Rochester

USA . 3,005 parts In-Stock

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$0.202

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Verical

USA . 1,459 parts In-Stock

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$0.140

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Farnell

UK . 1 parts In-Stock

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$0.166

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Distributors (In-Stock)

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Digiode

USA . 4,908 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Vyrian

USA . 36,384 parts In-Stock

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Sea View Technologies

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Prism Electronics

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Atlantic Semiconductor

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PC Components Company LLC

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Connector Distribution Corp

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Right Parts Inc.

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Distributors (Availability)

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Ampacity Inc.

Singapore . 36,465 parts In-Stock

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$0.097

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Semicontronic

India . 33,130 parts In-Stock

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$0.097

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$0.095

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$0.094

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Corphita

USA . 3,438 parts In-Stock

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$0.119

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$0.291

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Aranea Global

USA . 100 parts In-Stock

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$0.284

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Argo Parts USA

USA . 631 parts In-Stock

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631

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Continental Prestige Electronics

USA . 407 parts In-Stock

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$0.311

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Microchip USA

USA . 6,650 parts In-Stock

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$1.728

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Andel Nordic

Denmark . 3,295 parts In-Stock

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Parana Technologies

USA . 1,445 parts In-Stock

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$21.187

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$21.478

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ChromeModa Solutions

Germany . 5,851 parts In-Stock

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$23.806

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IDEA Electronic Components Group

UK . 352 parts In-Stock

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$23.806

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$22.616

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$21.425

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Corohmni

South Africa . 204 parts In-Stock

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Perfect Parts

USA . 18,435 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Glotronic Ltd.

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Authorized Procurement Solutions

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Cyclops Electronics Ltd (Excess)

UK . 2,000 parts In-Stock

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Kepictronics

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Supply Digital

USA . 886 parts In-Stock

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DigiPath Technology Company

USA . 466 parts In-Stock

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Overview

Experience the unmatched quality and performance of the CD74HC125M96 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments is known for delivering cutting-edge solutions that meet the highest standards. The CD74HC125M96 belongs to the category of Bus Driver & Transceivers, making it an essential component for various applications. With its compact design and superior functionality, this product offers tremendous value to customers. Benefit from its fast propagation delay, surface mount technology, and 3-STATE output characteristics. Whether you're working on military-grade projects or seeking reliable components for your electronic designs, the CD74HC125M96 is the perfect choice. Trust Texas Instruments for exceptional performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's package body material is made of plastic/epoxy, which provides durability and protection for the internal components, making it a reliable choice.

Propagation Delay At Nominal Supply: 30 ns

With a propagation delay of only 30 ns at the nominal supply, this product ensures fast and efficient data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mount compatible, this bus driver & transceiver can be easily mounted onto circuit boards, simplifying assembly and allowing for space-efficient designs.

No. of Functions: 4

With four functions integrated into a single component, this product offers increased functionality and versatility, making it a cost-effective choice for various applications.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for easy integration into existing system designs, ensuring compatibility and providing convenience during installation.

No. of Bits: 1

This bus driver & transceiver has a capacity of 1 bit, making it suitable for applications where low power consumption and simplicity are desired.

Nominal Supply Voltage / Vsup (V): 4.5

With a nominal supply voltage of 4.5V, this product operates efficiently within a common voltage range, allowing for compatibility with many different systems and power sources.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures proper signal handling and stability, making this product a reliable choice for driving bus lines and transceiving signals.

Power Supplies (V): 2/6

With power supplies ranging from 2V to 6V, this product offers flexibility in terms of voltage input requirements, making it adaptable to various power sources and system configurations.

No. of Terminals: 14

Equipped with 14 terminals, this bus driver & transceiver provides ample connectivity options, accommodating various input and output requirements for seamless integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style of this product ensures space-saving installation and compatibility with modern assembly techniques, making it ideal for compact electronic devices.

Maximum I (ol): 6 Amp

With a maximum output current of 6 Amps, this product is capable of driving high-power loads, making it suitable for applications that require robust and reliable signal transmission.

Propagation Delay (tpd): 150 ns

Featuring a propagation delay of 150 ns, this bus driver & transceiver ensures efficient data transmission with minimal delay, enhancing system performance and overall response time.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, making it suitable for use in demanding conditions and industrial applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics of this product provide flexibility in controlling the output signals, enabling efficient bus sharing and enhancing system scalability.

Minimum Operating Temperature: -55 °C

Designed to operate even at temperatures as low as -55°C, this bus driver & transceiver is suitable for use in extreme cold conditions, ensuring reliable performance in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel, palladium, and gold provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and prolonged product lifespan.

Terminal Position: DUAL

With a dual terminal position, this product offers versatility in mounting options, allowing for efficient PCB layout and enhanced design flexibility.

No. of Ports: 2

Equipped with two ports, this bus driver & transceiver provides multiple interface options for connecting to different devices or systems, enhancing versatility and compatibility.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this product allows for compact and low-profile designs, making it suitable for space-constrained applications and designs.

Width: 3.9 mm

The compact width of 3.9 mm makes this bus driver & transceiver ideal for use in space-limited applications, enabling streamlined designs and efficient use of available space.

Output Polarity: TRUE

With a true output polarity, this product ensures accurate signal transmission and compatibility with devices that require a specific polarity, making it a reliable choice for diverse applications.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this bus driver & transceiver offers flexibility in power supply options, allowing for compatibility with low-voltage systems and energy-efficient designs.

Peak Reflow Temperature °C: 260

Designed to withstand peak reflow temperatures of 260°C, this product can endure the soldering process during assembly, ensuring reliable connections and ease of manufacturing.

Length: 8.65 mm

The length of 8.65 mm makes this bus driver & transceiver compact and suitable for applications where space optimization is crucial, enabling efficient and compact system designs.

Temperature Grade: MILITARY

This product is designed to meet military-grade temperature standards, making it highly reliable and suitable for demanding and harsh environments.

Technology: CMOS

Built using CMOS technology, this bus driver & transceiver offers low power consumption and high noise immunity, making it energy-efficient and reliable for various applications.

Terminal Form: GULL WING

Featuring a gull-wing terminal form, this product ensures secure and reliable solder connections during assembly, enhancing the overall durability and performance of the final product.

Packing Method: TR

This bus driver & transceiver is packed in tape and reel (TR), providing convenience and ease of use during manufacturing and assembly processes.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product allows for precise and reliable connections, making it suitable for applications that require high-density packaging and fine-pitch requirements.

Count Direction: UNIDIRECTIONAL

Designed for unidirectional signal transmission, this bus driver & transceiver ensures accurate and efficient communication in a single direction, enhancing system reliability and performance.

Control Type: ENABLE LOW

With an enable low control type, this product offers ease of use and compatibility with systems that utilize the enable pin for device operation, making it a versatile choice for various applications.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 ensures that this bus driver & transceiver can be stored and used in environments with low humidity, minimizing the risk of moisture-related damages.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this product can operate reliably within a wide range of voltage inputs, providing versatility and compatibility with various power sources.

Maximum Power Supply Current (ICC): 0.16 mA

Consuming a maximum power supply current of only 0.16 mA, this bus driver & transceiver offers energy efficiency and low power consumption, making it suitable for battery-powered applications.

Technical Specifications

Bus Driver & Transceivers CD74HC125M96 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74HC125M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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