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CD4724BNSRG4

Texas Instruments

CD4724BNSRG4 by Texas Instruments

CD4724BNSRG4 by Texas Instruments is a CMOS latches & flip-flops IC with 16 terminals. It operates at a supply voltage range of 3-18V and has a propagation delay of 400ns. Suitable for military-grade applications, it features low-level trigger type and true output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,891 parts In-Stock

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Digiode

USA . 4,932 parts In-Stock

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4,932

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Distributors (Availability)

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Native Components

USA . 893 parts In-Stock

1+ parts

$0.185

100+ parts

-

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$0.178

893

$0.185

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$0.178

Northwest PG Solutions

USA . 1,719 parts In-Stock

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$0.204

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-

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$0.179

1,719

$0.204

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$0.179

AZTECH Wire

Italy . 202 parts In-Stock

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$15.445

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202

$15.445

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Parana Technologies

USA . 440 parts In-Stock

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$19.057

100+ parts

$1,769.702

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$17.151

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440

$19.057

$1,769.702

$17.151

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DigiPath Technology Company

USA . 596 parts In-Stock

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$20.984

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596

$20.984

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ChromeModa Solutions

Germany . 6,808 parts In-Stock

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$21.412

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$17.558

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6,808

$21.412

$17.558

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IDEA Electronic Components Group

UK . 445 parts In-Stock

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$21.412

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$20.341

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$19.271

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445

$21.412

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One Stop Electronics

USA . 165 parts In-Stock

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$25.000

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QUARKTWIN TECHNOLOGY LTD

USA . 23,200 parts In-Stock

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Corphita

USA . 1,153 parts In-Stock

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Microchip USA

USA . 412 parts In-Stock

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Overview

Enhance your electronic projects with the CD4724BNSRG4 by Texas Instruments, a high-quality latch & flip-flop component that guarantees reliability and performance. Manufactured by a trusted brand like Texas Instruments, this product is suited for a wide range of applications. With quick propagation delay, low trigger type, and military-grade temperature tolerance, this small outline package offers exceptional value and benefits to customers seeking seamless integration and efficient operation. Experience the advantage of advanced technology and superior design with the CD4724BNSRG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 400 ns

The low propagation delay of 400 ns ensures fast response times, making this latch or flip-flop suitable for applications that require quick switching.

Surface Mount: YES

Being surface mount enables easy and efficient assembly onto circuit boards, saving space and facilitating automated manufacturing processes.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility with a wide range of devices.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance indicates the maximum capacitance that the latch or flip-flop can drive, allowing for reliable operation with external components.

Power Supplies (V): 5/15

This latch or flip-flop can operate with dual power supplies of 5V and 15V, offering flexibility in different circuit configurations.

No. of Terminals: 16

The 16 terminals provide multiple connection points for interfacing with other components, making it versatile for different circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch or flip-flop can withstand elevated temperatures in various environments.

Trigger Type: LOW LEVEL

The low-level trigger type ensures reliable operation by responding to low input voltage levels, making it compatible with different signal sources.

Minimum Operating Temperature: -55 °C

The -55°C minimum operating temperature allows this latch or flip-flop to function in cold environments without performance degradation.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit layout and connections, allowing for different mounting orientations and wiring configurations.

Maximum Seated Height: 2 mm

The low maximum seated height of 2 mm helps in reducing the overall profile of the electronic device, especially in slim designs.

Width: 5.3 mm

The compact width of 5.3 mm enables efficient use of space on the circuit board and facilitates dense packing of components.

Output Polarity: TRUE

The true output polarity ensures accurate signal processing and compatibility with other components that expect a specific output voltage level.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this latch or flip-flop can operate effectively even with lower voltage power sources.

Length: 10.2 mm

The length of 10.2 mm provides a compact form factor for the latch or flip-flop, making it suitable for space-constrained applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environmental conditions, making it suitable for rugged applications.

Technology: CMOS

The CMOS technology used in this latch or flip-flop offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring secure connections on the circuit board.

Packing Method: TR

The TR packing method offers protection during shipping and handling, ensuring that the latch or flip-flop reaches the end user in good condition.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise placement on the circuit board and facilitates reliable connections with other components.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, this latch or flip-flop can handle higher voltage levels, providing flexibility in different circuit designs.

Technical Specifications

Latches & Flip-Flops CD4724BNSRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

LATCH ACTS AS 1-OF-8 DEMULTIPLEXER

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

400 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

LOW LEVEL

Width:

5.3 mm

Trade Compliance

CD4724BNSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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