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CD4724BPWRE4

Texas Instruments

CD4724BPWRE4 by Texas Instruments

CD4724BPWRE4 by Texas Instruments is a CMOS latch with 400 ns propagation delay at 5V, suitable for military applications. It features a small outline package, dual terminals, and operates b/w -55 to 125 °C. Ideal for low-level trigger applications requiring true output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,998 parts In-Stock

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Digiode

USA . 4,135 parts In-Stock

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4,135

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Northwest PG Solutions

USA . 1,890 parts In-Stock

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$2.599

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$2.599

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AZTECH Wire

Italy . 714 parts In-Stock

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$13.351

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One Stop Electronics

USA . 1,497 parts In-Stock

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$27.000

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Parana Technologies

USA . 1,673 parts In-Stock

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$28.211

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$44.952

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DigiPath Technology Company

USA . 463 parts In-Stock

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$31.064

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463

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ChromeModa Solutions

Germany . 945 parts In-Stock

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$31.698

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$25.992

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$31.698

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IDEA Electronic Components Group

UK . 657 parts In-Stock

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$31.698

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$30.113

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$28.528

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Microchip USA

USA . 3,994 parts In-Stock

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Corphita

USA . 3,554 parts In-Stock

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Native Components

USA . 650 parts In-Stock

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Overview

Upgrade your electronic projects with the CD4724BPWRE4 by Texas Instruments, a top-quality latch and flip-flop device designed to meet the highest standards in the industry. Manufactured by Texas Instruments, known for their reliability and innovation, this product offers unmatched performance and durability. Ideal for various applications, this versatile component boasts a low propagation delay and true output polarity. Experience seamless integration and enhanced functionality with the CD4724BPWRE4, providing value and benefits that will surpass your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch or flip-flop, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 400 ns

Low propagation delay ensures quick response times, making this product suitable for high-speed applications.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying assembly process.

Nominal Supply Voltage: 5V

Common and stable supply voltage, compatible with many electronic systems.

Load Capacitance: 50 pF

Optimal load capacitance for efficient performance and stability.

Maximum Operating Temperature: 125°C

Can withstand high temperatures, suitable for a wide range of operating environments.

Trigger Type: LOW LEVEL

Low-level trigger type ensures reliable and consistent operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for modern electronic devices.

Technical Specifications

Latches & Flip-Flops CD4724BPWRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

LATCH ACTS AS 1-OF-8 DEMULTIPLEXER

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

400 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

4.4 mm

Trade Compliance

CD4724BPWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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