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CD4724BF3A

Texas Instruments

CD4724BF3A by Texas Instruments

CD4724BF3A by Texas Instruments is an 8-bit latch with a propagation delay of 150 ns at 5V. It operates in temperatures ranging from -55 to 125°C, making it suitable for military-grade applications. With a max supply voltage of 18V and low power consumption, it is ideal for high-reliability systems.

Median Price

$14.402

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 31 parts In-Stock

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$15.514

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$15.514

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Rochester

USA . 4 parts In-Stock

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$13.290

1k+ parts

$11.890

10k+ parts

$11.190

4

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$13.290

$11.890

$11.190

Distributors (In-Stock)

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Digiode

USA . 817 parts In-Stock

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$14.060

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$14.060

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Vyrian

USA . 6,812 parts In-Stock

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Beltway Electronics Company

USA . 22 parts In-Stock

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Speed Components Ltd

Israel . 15 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 7 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 990 parts In-Stock

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$0.230

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$0.221

990

$0.230

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$0.221

Northwest PG Solutions

USA . 2,003 parts In-Stock

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$0.253

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$0.223

2,003

$0.253

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$0.223

Corphita

USA . 945 parts In-Stock

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$13.320

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945

$13.320

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Component Stockers USA

USA . 3,539 parts In-Stock

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$15.100

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$11.390

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Parana Technologies

USA . 668 parts In-Stock

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$20.228

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$20.208

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$20.228

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$20.208

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DigiPath Technology Company

USA . 721 parts In-Stock

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$22.273

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$20.492

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721

$22.273

$20.492

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ChromeModa Solutions

Germany . 6,363 parts In-Stock

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$22.728

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$18.637

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$22.728

$18.637

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IDEA Electronic Components Group

UK . 1,143 parts In-Stock

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$22.728

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$21.592

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$20.455

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$22.728

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$20.455

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QUARKTWIN TECHNOLOGY LTD

USA . 23,708 parts In-Stock

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Microchip USA

USA . 12,140 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Supply Digital

USA . 2,661 parts In-Stock

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Metaverse IC Inc.

Canada . 1,048 parts In-Stock

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Kepictronics

USA . 151 parts In-Stock

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Overview

Enhance your electronic projects with the CD4724BF3A by Texas Instruments, a top-of-the-line latch & flip-flop component designed for reliability and performance. Crafted with precision by a renowned manufacturer, this product offers seamless integration and superior functionality. With a wide range of applications in various industries, this innovative device ensures smooth operation and efficient output. Elevate your projects to new heights with the quality and value that the CD4724BF3A brings to the table. Upgrade your electronics today and experience the difference!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 150 ns

Fast propagation delay ensures quick response times, ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply, making it easy to integrate into existing systems.

No. of Bits: 8

8-bit configuration offers sufficient data storage capacity for various applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and military-grade applications.

Technical Specifications

Latches & Flip-Flops CD4724BF3A attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

LATCH ACTS AS 1-OF-8 DEMULTIPLEXER

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.3 mA

Propagation Delay At Nominal Supply:

150 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

LOW LEVEL

Width:

6.92 mm

Trade Compliance

CD4724BF3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-066-1590, 5962010661590

NIIN

010661590

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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