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CD4724BNSR

Texas Instruments

CD4724BNSR by Texas Instruments

CD4724BNSR by Texas Instruments is a CMOS latch with 16 terminals and a propagation delay of 400 ns at 5V. It operates in temperatures ranging from -55 to 125 °C and is suitable for military-grade applications requiring low-level trigger type latches.

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1k+

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Vyrian

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Digiode

USA . 1,866 parts In-Stock

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Native Components

USA . 542 parts In-Stock

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$0.378

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$0.363

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Northwest PG Solutions

USA . 2,320 parts In-Stock

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$0.416

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$0.367

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AZTECH Wire

Italy . 414 parts In-Stock

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$6.506

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Parana Technologies

USA . 367 parts In-Stock

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DigiPath Technology Company

USA . 1,232 parts In-Stock

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$31.170

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$28.676

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ChromeModa Solutions

Germany . 576 parts In-Stock

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$31.806

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IDEA Electronic Components Group

UK . 220 parts In-Stock

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One Stop Electronics

USA . 1,444 parts In-Stock

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Glotronic Ltd.

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Corphita

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Microchip USA

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Overview

Unlock the potential of your electronic designs with the CD4724BNSR from Texas Instruments, a top-tier manufacturer known for quality and reliability. As part of the Latches & Flip-Flops category, this product offers fast propagation delay, surface mount capability, and a wide range of operating temperatures. With a nominal supply voltage of 5V and military-grade temperature rating, this versatile component is perfect for various applications. Experience seamless integration, superior performance, and exceptional value with the CD4724BNSR - the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 400 ns

The low propagation delay of 400 ns ensures fast and efficient operation of the latches & flip-flops, making them suitable for high-speed applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on circuit boards, making them convenient for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage makes these latches & flip-flops compatible with standard power sources, making them versatile for a wide range of projects.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance ensures stable performance and prevents signal distortion, making these latches & flip-flops reliable for use in electronic circuits.

Power Supplies (V): 5/15

The availability of both 5V and 15V power supplies allows for flexibility in power options, accommodating different system requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the latches & flip-flops can withstand elevated temperatures, making them suitable for harsh environments.

Trigger Type: LOW LEVEL

The low-level trigger type ensures accurate and reliable signal detection, preventing false triggering and ensuring precise operation of the latches & flip-flops.

Technology: CMOS

The CMOS technology used in these latches & flip-flops offers low power consumption and high noise immunity, making them energy-efficient and reliable in noisy environments.

Technical Specifications

Latches & Flip-Flops CD4724BNSR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

LATCH ACTS AS 1-OF-8 DEMULTIPLEXER

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

400 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

LOW LEVEL

Width:

5.3 mm

Trade Compliance

CD4724BNSR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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