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CC3120RNMARGKT

Texas Instruments

CC3120RNMARGKT by Texas Instruments

CC3120RNMARGKT by Texas Instruments is a wireless LAN circuit with 64 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3.3V. Ideal for network interfaces, it features nickel palladium gold terminal finish and is suitable for industrial applications.

Median Price

$6.933

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,330 parts In-Stock

1+ parts

$6.933

100+ parts

$5.652

1k+ parts

$3.768

10k+ parts

-

8,330

$6.933

$5.652

$3.768

-

DigiKey

USA . 497 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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497

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,062 parts In-Stock

1+ parts

$6.586

100+ parts

-

1k+ parts

-

10k+ parts

-

2,062

$6.586

-

-

-

Vyrian

USA . 5,010 parts In-Stock

1+ parts

-

100+ parts

-

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5,010

-

-

-

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Bristol Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

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-

-

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Chip Stock

USA . 175 parts In-Stock

1+ parts

-

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175

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

-

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-

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150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,159 parts In-Stock

1+ parts

$5.890

100+ parts

-

1k+ parts

-

10k+ parts

-

4,159

$5.890

-

-

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Corphita

USA . 3,120 parts In-Stock

1+ parts

$6.240

100+ parts

-

1k+ parts

-

10k+ parts

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3,120

$6.240

-

-

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Parana Technologies

USA . 2,220 parts In-Stock

1+ parts

$9.159

100+ parts

-

1k+ parts

$9.808

10k+ parts

-

2,220

$9.159

-

$9.808

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DigiPath Technology Company

USA . 1,931 parts In-Stock

1+ parts

$10.085

100+ parts

-

1k+ parts

-

10k+ parts

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1,931

$10.085

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-

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ChromeModa Solutions

Germany . 6,864 parts In-Stock

1+ parts

$10.291

100+ parts

$8.439

1k+ parts

-

10k+ parts

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6,864

$10.291

$8.439

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IDEA Electronic Components Group

UK . 1,555 parts In-Stock

1+ parts

$10.291

100+ parts

$9.776

1k+ parts

$9.262

10k+ parts

-

1,555

$10.291

$9.776

$9.262

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,000

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Overview

Unlock the power of seamless wireless connectivity with the CC3120RNMARGKT by Texas Instruments. As a trusted leader in network interfaces, Texas Instruments delivers top-notch quality and reliability. This innovative product is perfect for a wide range of applications, offering customers unparalleled value and benefits. Say goodbye to connectivity issues and hello to smooth, efficient operations with the CC3120RNMARGKT. Trust Texas Instruments to provide you with the tools you need to stay ahead in today's connected world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the network interface, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 64

Offers a sufficient number of connections for a complex network interface, enabling multiple functions and features.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in various environmental conditions, making the product suitable for industrial use.

Nominal Supply Voltage: 3.3 V

Provides a stable voltage input for the network interface, ensuring consistent and efficient operation.

Technical Specifications

Network Interfaces CC3120RNMARGKT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC3120RNMARGKT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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