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CC3120MODRNMMOBR

Texas Instruments

CC3120MODRNMMOBR by Texas Instruments

CC3120MODRNMMOBR by Texas Instruments is a wireless LAN circuit with 63 terminals, operating at -40 to 85°C. It features a grid array package style, nickel gold terminal finish, and 3.3V supply voltage. Ideal for industrial applications requiring reliable network interfaces in compact spaces.

Median Price

$22.540

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,606 parts In-Stock

1+ parts

$13.917

100+ parts

$12.157

1k+ parts

$8.384

10k+ parts

-

2,606

$13.917

$12.157

$8.384

-

Mouser Electronics

USA . 732 parts In-Stock

1+ parts

$22.540

100+ parts

$16.470

1k+ parts

$15.250

10k+ parts

-

732

$22.540

$16.470

$15.250

-

DigiKey

USA . 638 parts In-Stock

1+ parts

$22.540

100+ parts

$17.277

1k+ parts

$16.455

10k+ parts

-

638

$22.540

$17.277

$16.455

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 49 parts In-Stock

1+ parts

$10.560

100+ parts

-

1k+ parts

-

10k+ parts

-

49

$10.560

-

-

-

Digiode

USA . 2,274 parts In-Stock

1+ parts

$13.221

100+ parts

-

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-

10k+ parts

-

2,274

$13.221

-

-

-

Vyrian

USA . 1,527 parts In-Stock

1+ parts

-

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-

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-

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1,527

-

-

-

-

Bristol Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

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10

-

-

-

-

ComSIT Distribution GmbH

Germany . 3 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,264 parts In-Stock

1+ parts

$7.940

100+ parts

-

1k+ parts

$8.503

10k+ parts

-

1,264

$7.940

-

$8.503

-

IDEA Electronic Components Group

UK . 1,979 parts In-Stock

1+ parts

$8.921

100+ parts

$8.475

1k+ parts

$8.029

10k+ parts

-

1,979

$8.921

$8.475

$8.029

-

ChromeModa Solutions

Germany . 1,606 parts In-Stock

1+ parts

$8.921

100+ parts

$7.315

1k+ parts

-

10k+ parts

-

1,606

$8.921

$7.315

-

-

Corohmni

South Africa . 389 parts In-Stock

1+ parts

$10.013

100+ parts

-

1k+ parts

-

10k+ parts

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389

$10.013

-

-

-

Continental Prestige Electronics

USA . 2,722 parts In-Stock

1+ parts

$10.560

100+ parts

-

1k+ parts

-

10k+ parts

$10.349

2,722

$10.560

-

-

$10.349

Ampacity Inc.

Singapore . 1,561 parts In-Stock

1+ parts

$11.830

100+ parts

-

1k+ parts

-

10k+ parts

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1,561

$11.830

-

-

-

Corphita

USA . 4,239 parts In-Stock

1+ parts

$12.525

100+ parts

-

1k+ parts

-

10k+ parts

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4,239

$12.525

-

-

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$14.713

100+ parts

$13.389

1k+ parts

$12.065

10k+ parts

-

10

$14.713

$13.389

$12.065

-

Lixinc

USA . 17,700 parts In-Stock

1+ parts

-

100+ parts

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17,700

-

-

-

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A-Z Elektronik GmbH

Germany . 11,902 parts In-Stock

1+ parts

-

100+ parts

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11,902

-

-

-

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Argo Parts USA

USA . 1,988 parts In-Stock

1+ parts

-

100+ parts

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1,988

-

-

-

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DigiPath Technology Company

USA . 949 parts In-Stock

1+ parts

-

100+ parts

$8.043

1k+ parts

-

10k+ parts

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949

-

$8.043

-

-

Overview

Unlock the power of seamless connectivity with the Texas Instruments CC3120MODRNMMOBR. This cutting-edge Network Interface module boasts top-notch quality and reliability from a trusted manufacturer. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers looking for fast, secure, and efficient wireless LAN solutions. Say goodbye to connectivity issues and hello to a world of endless possibilities with the CC3120MODRNMMOBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto PCBs, saving space and facilitating automated assembly processes.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions without compromising performance.

Nominal Supply Voltage: 3.3V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, making it easy to incorporate into existing systems.

Technical Specifications

Network Interfaces CC3120MODRNMMOBR attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B63

JESD-609 Code:

e4

Length:

20.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

63

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

LGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.5 mm

Trade Compliance

CC3120MODRNMMOBR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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