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MCP2003B-E/SN

Microchip Technology

MCP2003B-E/SN by Microchip Technology

MCP2003B-E/SN by Microchip: LIN transceiver for telecom apps. Operates at -40 to 125°C, with 12V supply voltage. Small outline package, dual terminals, matte tin finish.

Median Price

$0.900

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 27,038 parts In-Stock

1+ parts

$0.720

100+ parts

$0.558

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-

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27,038

$0.720

$0.558

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DigiKey

USA . 11,329 parts In-Stock

1+ parts

$0.900

100+ parts

$0.690

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-

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11,329

$0.900

$0.690

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Mouser Electronics

USA . 3,759 parts In-Stock

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$0.900

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3,759

$0.900

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Microchip Technology

USA . 350 parts In-Stock

1+ parts

$0.900

100+ parts

$0.690

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$0.650

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350

$0.900

$0.690

$0.650

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Newark

USA . 11,428 parts In-Stock

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$0.927

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$0.927

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Element14

Singapore . 27,038 parts In-Stock

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$1.310

100+ parts

$1.010

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27,038

$1.310

$1.010

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Master Electronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$0.688

1k+ parts

$0.673

10k+ parts

$0.666

800

-

$0.688

$0.673

$0.666

Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

$0.809

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$0.800

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800

-

$0.809

$0.800

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Distrelec

Netherlands . 450 parts In-Stock

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450

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Arrow

USA . 10 parts In-Stock

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$0.724

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10

-

$0.724

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.872

100+ parts

-

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15

$0.872

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TME

Poland . 354 parts In-Stock

1+ parts

$0.960

100+ parts

$0.730

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354

$0.960

$0.730

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Vyrian

USA . 12,866 parts In-Stock

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Chip Stock

USA . 6,101 parts In-Stock

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IBS Electronics

USA . 800 parts In-Stock

1+ parts

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100+ parts

$1.046

1k+ parts

$0.933

10k+ parts

$0.849

800

-

$1.046

$0.933

$0.849

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,304 parts In-Stock

1+ parts

$0.580

100+ parts

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12,304

$0.580

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Semicontronic

India . 12,213 parts In-Stock

1+ parts

$0.580

100+ parts

$0.566

1k+ parts

$0.563

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12,213

$0.580

$0.566

$0.563

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Vigor

Singapore . 3,000 parts In-Stock

1+ parts

$0.700

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3,000

$0.700

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Argo Parts USA

USA . 2,972 parts In-Stock

1+ parts

$0.726

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2,972

$0.726

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Continental Prestige Electronics

USA . 28,059 parts In-Stock

1+ parts

$0.845

100+ parts

$0.620

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28,059

$0.845

$0.620

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$12.262

100+ parts

$11.649

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$11.649

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70

$12.262

$11.649

$11.649

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Corohmni

South Africa . 267 parts In-Stock

1+ parts

$15.872

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267

$15.872

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Aztec Data Supply Inc.

USA . 287 parts In-Stock

1+ parts

$16.410

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287

$16.410

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Modulus Dynamics

Lithuania . 1,906 parts In-Stock

1+ parts

$16.442

100+ parts

$16.442

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$16.442

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1,906

$16.442

$16.442

$16.442

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Lixinc

USA . 16,007 parts In-Stock

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XL Components Corporation

Australia . 5,288 parts In-Stock

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Marpe Global Electronics

Taiwan . 4,942 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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QualityLine Systems

Poland . 3,645 parts In-Stock

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Robosynatics

Brazil . 2,825 parts In-Stock

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2,825

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Lucentia Tech

USA . 2,825 parts In-Stock

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$11.740

1k+ parts

$11.501

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$11.501

2,825

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$11.740

$11.501

$11.501

Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Enhance your network interfaces with the MCP2003B-E/SN from Microchip Technology. With a reputation for high-quality products, Microchip offers a reliable LIN transceiver that is perfect for a wide range of applications. This small outline package boasts a dual terminal position and matte tin finish, ensuring seamless integration into your designs. Trust Microchip to deliver top-notch performance and value with the MCP2003B-E/SN. Elevate your networking capabilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various networking applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards, saving space and simplifying assembly processes.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, meeting industry standards and providing a dependable network interface solution.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard board layouts and facilitates integration into existing systems.

No. of Terminals: 8

Having 8 terminals allows for multiple connections, enabling the network interface to interact with various components effectively.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact devices and applications with limited room.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in demanding environments, offering reliability under varying conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the network interface remains functional in cold settings, making it versatile for use in different climates.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability, ensuring secure connections and enhancing the product's overall performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in layout and installation, accommodating different board designs and configurations.

Maximum Seated Height: 1.75 mm

The low maximum seated height helps in minimizing the overall profile of the product, contributing to space-saving and efficient system design.

Width: 3.9 mm

The compact width dimension aids in fitting the network interface into tight spaces and compact devices, enhancing versatility and integration options.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time of 40 seconds at peak reflow temperature, the product ensures quick and successful soldering processes, saving time during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for secure and reliable soldering of the network interface onto circuit boards, ensuring strong connections.

Length: 4.9 mm

The moderate length dimension provides a balanced form factor for the product, offering a good compromise between compact size and functional capabilities.

Terminal Form: GULL WING

The gull wing terminal form enhances mechanical stability and facilitates automated assembly processes, ensuring consistent and reliable connections.

Telecom IC Type: LIN TRANSCEIVER

The LIN transceiver type is suitable for telecom applications, providing efficient communication capabilities and ensuring compatibility with a wide range of devices.

Nominal Supply Voltage: 12 V

Having a nominal supply voltage of 12V makes the network interface compatible with standard power sources, simplifying integration into various systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm offers a good balance between spacing and connectivity, ensuring reliable connections while optimizing board space usage.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during handling and storage, maintaining performance integrity.

Technical Specifications

Network Interfaces MCP2003B-E/SN attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MCP2003B-E/SN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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