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CC3100R11MRGC

Texas Instruments

CC3100R11MRGC by Texas Instruments

CC3100R11MRGC by Texas Instruments is a wireless LAN circuit with 64 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 1.8V. Ideal for network interfaces, it features surface mount capability and nickel palladium gold terminal finish.

Median Price

$11.890

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,549 parts In-Stock

1+ parts

$8.370

100+ parts

$6.824

1k+ parts

$4.549

10k+ parts

-

1,549

$8.370

$6.824

$4.549

-

DigiKey

USA . 3,054 parts In-Stock

1+ parts

$11.890

100+ parts

$9.043

1k+ parts

$8.267

10k+ parts

$7.972

3,054

$11.890

$9.043

$8.267

$7.972

Mouser Electronics

USA . 406 parts In-Stock

1+ parts

$11.890

100+ parts

$8.090

1k+ parts

$7.860

10k+ parts

$7.630

406

$11.890

$8.090

$7.860

$7.630

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,070 parts In-Stock

1+ parts

$7.362

100+ parts

-

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-

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3,070

$7.362

-

-

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Vyrian

USA . 496 parts In-Stock

1+ parts

$7.750

100+ parts

-

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-

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496

$7.750

-

-

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Bristol Electronics

USA . 10 parts In-Stock

1+ parts

$10.179

100+ parts

-

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-

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10

$10.179

-

-

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Electronics Depot

USA . 20 parts In-Stock

1+ parts

-

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20

-

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

1+ parts

-

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10

-

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Dan-Mar Components

USA . 10 parts In-Stock

1+ parts

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10

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Semtec, LLC

USA . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 875 parts In-Stock

1+ parts

$6.059

100+ parts

-

1k+ parts

$6.837

10k+ parts

-

875

$6.059

-

$6.837

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DigiPath Technology Company

USA . 1,592 parts In-Stock

1+ parts

$6.672

100+ parts

-

1k+ parts

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1,592

$6.672

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Native Components

USA . 415 parts In-Stock

1+ parts

$6.720

100+ parts

-

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415

$6.720

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IDEA Electronic Components Group

UK . 2,032 parts In-Stock

1+ parts

$6.808

100+ parts

-

1k+ parts

$6.127

10k+ parts

-

2,032

$6.808

-

$6.127

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ChromeModa Solutions

Germany . 143 parts In-Stock

1+ parts

$6.808

100+ parts

$5.583

1k+ parts

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10k+ parts

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143

$6.808

$5.583

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Corphita

USA . 2,292 parts In-Stock

1+ parts

$6.975

100+ parts

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2,292

$6.975

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$10.336

100+ parts

$9.406

1k+ parts

$8.476

10k+ parts

-

70

$10.336

$9.406

$8.476

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Lixinc

USA . 13,854 parts In-Stock

1+ parts

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13,854

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A-Z Elektronik GmbH

Germany . 5,432 parts In-Stock

1+ parts

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5,432

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Perfect Parts

USA . 4,659 parts In-Stock

1+ parts

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4,659

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Alle Elektronik GmbH

Germany . 3,621 parts In-Stock

1+ parts

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3,621

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Northwest PG Solutions

USA . 2,043 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$6.586

10k+ parts

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2,043

-

-

$6.586

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S.R.D Solutions

India . 200 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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200

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Overview

Unlock seamless connectivity and endless possibilities with the Texas Instruments CC3100R11MRGC. This innovative wireless LAN circuit offers unparalleled reliability and performance, making it the ideal choice for a wide range of network interface applications. With its cutting-edge technology and top-notch quality, this product guarantees fast and secure connections, all while maintaining a sleek and compact design. Say goodbye to connectivity issues and hello to a world of seamless communication with the CC3100R11MRGC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the network interface, making it resistant to wear and tear.

Surface Mount: YES

The surface mount feature allows for easy installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square shape of the package provides a compact and efficient design, ideal for space-constrained applications.

No. of Terminals: 64

With 64 terminals, this network interface offers a high level of connectivity options for various devices and systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the network interface to function effectively in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and reliable connections.

Terminal Position: QUAD

The quad terminal position allows for efficient signal transmission and connectivity, enhancing the overall performance of the network interface.

Maximum Seated Height: 1 mm

The low maximum seated height enables a slim and compact design, ideal for space-constrained applications.

Width: 9 mm

The narrow width of the network interface makes it easy to integrate into various electronic devices and systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps prevent damage to the network interface during soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and connectivity, enhancing the overall performance of the network interface.

Length: 9 mm

The compact length of the network interface allows for easy integration into various electronic devices and systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the network interface can withstand harsh environmental conditions and operate reliably in industrial settings.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and compliant with regulations, making it a sustainable choice for electronic devices.

Telecom IC Type: WIRELESS LAN CIRCUIT

The wireless LAN circuit type enables wireless connectivity and communication, making the network interface suitable for networking applications.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage ensures energy efficiency and reduces power consumption, making the network interface cost-effective to operate.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting and connectivity, making the network interface suitable for compact electronic devices.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the network interface can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Network Interfaces CC3100R11MRGC attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC3100R11MRGC Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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