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CC2533F32RHAR

Texas Instruments

CC2533F32RHAR by Texas Instruments

CC2533F32RHAR by Texas Instruments is a telecom IC with 40 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it offers high performance in compact designs.

Median Price

$5.454

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,892 parts In-Stock

1+ parts

$5.454

100+ parts

$4.446

1k+ parts

$2.964

10k+ parts

-

5,892

$5.454

$4.446

$2.964

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 748 parts In-Stock

1+ parts

$5.181

100+ parts

-

1k+ parts

-

10k+ parts

-

748

$5.181

-

-

-

Vyrian

USA . 9,402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,402

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,450 parts In-Stock

1+ parts

$4.640

100+ parts

-

1k+ parts

-

10k+ parts

-

5,450

$4.640

-

-

-

Corphita

USA . 1,463 parts In-Stock

1+ parts

$4.909

100+ parts

-

1k+ parts

-

10k+ parts

-

1,463

$4.909

-

-

-

Native Components

USA . 137 parts In-Stock

1+ parts

$10.050

100+ parts

-

1k+ parts

-

10k+ parts

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137

$10.050

-

-

-

Northwest PG Solutions

USA . 839 parts In-Stock

1+ parts

$11.055

100+ parts

$9.950

1k+ parts

-

10k+ parts

-

839

$11.055

$9.950

-

-

Parana Technologies

USA . 1,230 parts In-Stock

1+ parts

$13.658

100+ parts

-

1k+ parts

$14.159

10k+ parts

-

1,230

$13.658

-

$14.159

-

DigiPath Technology Company

USA . 10 parts In-Stock

1+ parts

$15.039

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$15.039

-

-

-

ChromeModa Solutions

Germany . 2,421 parts In-Stock

1+ parts

$15.346

100+ parts

$12.584

1k+ parts

-

10k+ parts

-

2,421

$15.346

$12.584

-

-

IDEA Electronic Components Group

UK . 853 parts In-Stock

1+ parts

$15.346

100+ parts

$14.579

1k+ parts

$13.811

10k+ parts

-

853

$15.346

$14.579

$13.811

-

AZTECH Wire

Italy . 767 parts In-Stock

1+ parts

$19.910

100+ parts

-

1k+ parts

-

10k+ parts

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767

$19.910

-

-

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20,000

-

-

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Lixinc

USA . 11,671 parts In-Stock

1+ parts

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11,671

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GreenTree Electronics

Israel . 7,500 parts In-Stock

1+ parts

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7,500

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-

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A-Z Elektronik GmbH

Germany . 4,779 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,779

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-

-

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

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3,790

-

-

-

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Alle Elektronik GmbH

Germany . 3,186 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,186

-

-

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Futuretech Components

Singapore . 133 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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133

-

-

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Kepictronics

USA . 62 parts In-Stock

1+ parts

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62

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Overview

Experience unparalleled quality and reliability with the CC2533F32RHAR by Texas Instruments, a leading manufacturer in the industry. This innovative telecom interface IC offers endless possibilities in various applications, providing customers with exceptional value and benefits. Whether you're looking to enhance communication systems or streamline operations, this product's advanced features and automotive-grade performance ensure optimal functionality and efficiency. Trust Texas Instruments to deliver top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Package Shape: SQUARE

Square package shape helps in space-saving on the PCB.

No. of Terminals: 40

Higher number of terminals allow for more connectivity options.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connectivity.

Maximum Seated Height: 1 mm

Low maximum seated height saves space on the PCB.

Width: 6 mm

Compact width dimension helps in fitting the component in limited spaces.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature reduces the risk of component damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability.

Length: 6 mm

Compact length dimension helps in space-saving on the PCB.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates the component's suitability for automotive applications.

Terminal Form: NO LEAD

No lead terminal form complies with environmental regulations and is safer for handling.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V is industry standard for telecom applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density packaging.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing and storage conditions.

Technical Specifications

Other Function Telecom Interface ICs CC2533F32RHAR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CC2533F32RHAR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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