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CC1352R1F3RGZT

Texas Instruments

CC1352R1F3RGZT by Texas Instruments

The Texas Instruments CC1352R1F3RGZT microcontroller features 32-bit architecture, 8-Ch 12-Bit ADC, and connectivity options like I2C and UART. Ideal for industrial applications requiring a wide operating temperature range (-40 to 85 °C) with low power consumption. Package style includes chip carrier and very thin profile suitable for compact designs.

Median Price

$9.751

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,047 parts In-Stock

1+ parts

$8.832

100+ parts

$7.200

1k+ parts

$4.800

10k+ parts

-

2,047

$8.832

$7.200

$4.800

-

DigiKey

USA . 450 parts In-Stock

1+ parts

$10.670

100+ parts

$8.114

1k+ parts

$7.273

10k+ parts

$7.082

450

$10.670

$8.114

$7.273

$7.082

Mouser Electronics

USA . 305 parts In-Stock

1+ parts

$10.670

100+ parts

$8.120

1k+ parts

$6.680

10k+ parts

-

305

$10.670

$8.120

$6.680

-

Chip1Stop

Japan . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.740

10k+ parts

-

250

-

-

$5.740

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$7.070

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$7.070

-

-

-

Digiode

USA . 3,221 parts In-Stock

1+ parts

$8.390

100+ parts

-

1k+ parts

-

10k+ parts

-

3,221

$8.390

-

-

-

Vyrian

USA . 3,499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,499

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 426 parts In-Stock

1+ parts

$4.880

100+ parts

$4.758

1k+ parts

$4.734

10k+ parts

-

426

$4.880

$4.758

$4.734

-

Ampacity Inc.

Singapore . 283 parts In-Stock

1+ parts

$4.880

100+ parts

-

1k+ parts

-

10k+ parts

-

283

$4.880

-

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$6.208

100+ parts

$6.208

1k+ parts

$6.208

10k+ parts

-

5,000

$6.208

$6.208

$6.208

-

Continental Prestige Electronics

USA . 1,485 parts In-Stock

1+ parts

$7.070

100+ parts

-

1k+ parts

-

10k+ parts

$6.929

1,485

$7.070

-

-

$6.929

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$7.070

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$7.070

-

-

-

Corphita

USA . 354 parts In-Stock

1+ parts

$7.949

100+ parts

-

1k+ parts

-

10k+ parts

-

354

$7.949

-

-

-

Parana Technologies

USA . 1,218 parts In-Stock

1+ parts

$35.217

100+ parts

-

1k+ parts

-

10k+ parts

-

1,218

$35.217

-

-

-

ChromeModa Solutions

Germany . 4,859 parts In-Stock

1+ parts

$39.570

100+ parts

$32.447

1k+ parts

-

10k+ parts

-

4,859

$39.570

$32.447

-

-

IDEA Electronic Components Group

UK . 2,254 parts In-Stock

1+ parts

$39.570

100+ parts

$37.592

1k+ parts

$35.613

10k+ parts

-

2,254

$39.570

$37.592

$35.613

-

Corohmni

South Africa . 205 parts In-Stock

1+ parts

$70.702

100+ parts

-

1k+ parts

-

10k+ parts

-

205

$70.702

-

-

-

Argo Parts USA

USA . 2,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,560

-

-

-

-

DigiPath Technology Company

USA . 1,178 parts In-Stock

1+ parts

-

100+ parts

$35.676

1k+ parts

-

10k+ parts

-

1,178

-

$35.676

-

-

Overview

Unlock the full potential of your next project with the CC1352R1F3RGZT microcontroller by Texas Instruments. Renowned for their quality and innovation, Texas Instruments delivers superior performance in a compact package. Ideal for a variety of applications, this microcontroller offers unparalleled value with features like ADC channels, DMA channels, and digital-to-analog converters. Get ready to take your designs to the next level with the CC1352R1F3RGZT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Maximum Supply Voltage: 3.8 V

Allows for flexibility in voltage input, making it suitable for a variety of applications.

Bit Size: 32

High bit size allows for complex operations and calculations to be performed efficiently.

ADC Channels: YES

Presence of ADC channels enables analog to digital conversion, expanding the range of input signals that can be processed.

Technology: CMOS

CMOS technology provides low power consumption and faster processing speeds, making the product efficient.

RAM Bytes: 81920

Large RAM size allows for storage and retrieval of a significant amount of data, enhancing the capabilities of the microcontroller.

Connectivity: I2C, I2S, SSI(2), UART(2)

Multiple connectivity options provide flexibility in interfacing with other devices and systems.

Technical Specifications

Microcontrollers CC1352R1F3RGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

32.768KHZ NOMINAL CRYSTAL CLOCK AVAILABLE

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

81920

ROM Words:

360448

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SSI(2), UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

CC1352R1F3RGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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