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CC1350F128RSMT

Texas Instruments

CC1350F128RSMT by Texas Instruments

Texas Instruments CC1350F128RSMT is a 32-bit microcontroller with 131072 ROM words, 28672 RAM bytes, and 8-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers connectivity via I2C, I2S, SSI(2), UART and features peripherals like DMA(32) and RTC. Operating temperature ranges from -40 to 85 °C.

Median Price

$6.868

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,456 parts In-Stock

1+ parts

$7.973

100+ parts

$6.500

1k+ parts

$4.333

10k+ parts

-

4,456

$7.973

$6.500

$4.333

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.764

10k+ parts

$5.513

250

-

-

$5.764

$5.513

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$5.767

100+ parts

-

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-

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52

$5.767

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Digiode

USA . 1,799 parts In-Stock

1+ parts

$7.574

100+ parts

-

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1,799

$7.574

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Chip Stock

USA . 5,550 parts In-Stock

1+ parts

-

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5,550

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Vyrian

USA . 4,762 parts In-Stock

1+ parts

-

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-

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4,762

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,695 parts In-Stock

1+ parts

$5.730

100+ parts

-

1k+ parts

-

10k+ parts

$5.615

3,695

$5.730

-

-

$5.615

Ampacity Inc.

Singapore . 2,302 parts In-Stock

1+ parts

$6.780

100+ parts

-

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2,302

$6.780

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Corphita

USA . 2,690 parts In-Stock

1+ parts

$7.176

100+ parts

-

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-

10k+ parts

-

2,690

$7.176

-

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$25.899

100+ parts

$23.568

1k+ parts

$21.237

10k+ parts

-

2,500

$25.899

$23.568

$21.237

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Corohmni

South Africa . 102 parts In-Stock

1+ parts

$32.938

100+ parts

-

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102

$32.938

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-

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Parana Technologies

USA . 490 parts In-Stock

1+ parts

$73.866

100+ parts

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490

$73.866

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DigiPath Technology Company

USA . 48 parts In-Stock

1+ parts

$81.336

100+ parts

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48

$81.336

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ChromeModa Solutions

Germany . 2,483 parts In-Stock

1+ parts

$82.996

100+ parts

$68.057

1k+ parts

-

10k+ parts

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2,483

$82.996

$68.057

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IDEA Electronic Components Group

UK . 445 parts In-Stock

1+ parts

$82.996

100+ parts

$78.846

1k+ parts

$74.696

10k+ parts

-

445

$82.996

$78.846

$74.696

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Argo Parts USA

USA . 3,212 parts In-Stock

1+ parts

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3,212

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Perfect Parts

USA . 4 parts In-Stock

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4

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Overview

Discover the innovative CC1350F128RSMT by Texas Instruments, a cutting-edge microcontroller designed to elevate your projects to new heights. With a focus on quality and reliability, Texas Instruments leads the industry in delivering top-of-the-line products. This microcontroller offers endless possibilities in various applications, providing customers with exceptional value and benefits. Say goodbye to limitations and hello to seamless connectivity, efficient performance, and unparalleled functionality with the CC1350F128RSMT. Elevate your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.8 V

With a maximum supply voltage of 3.8 V, this microcontroller can handle higher voltage inputs, making it suitable for a variety of applications.

Bit Size: 32

The 32-bit architecture allows for faster processing and more complex computations, making this microcontroller suitable for high-performance tasks.

ROM Words: 131072

The large ROM capacity of 131072 words enables storing a significant amount of program code or data, expanding the capabilities of the microcontroller.

RAM Bytes: 28672

The 28672 bytes of RAM provide ample space for data storage and manipulation, allowing for efficient operation of the microcontroller.

Analog To Digital Convertors: 8-Ch 12-Bit

The presence of 8 analog to digital converters with 12-bit resolution allows for accurate and precise analog signal measurements, making this microcontroller ideal for sensor applications.

Connectivity: I2C, I2S, SSI(2), UART

The multiple connectivity options like I2C, I2S, SSI, and UART enable easy interfacing with other devices, expanding the usability and versatility of the microcontroller.

Technical Specifications

Microcontrollers CC1350F128RSMT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

32.768KHZ NOMINAL CRYSTAL CLOCK AVAILABLE

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

10

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SSI(2), UART

Peripherals:

COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

CC1350F128RSMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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