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CC1350F128RGZR

Texas Instruments

CC1350F128RGZR by Texas Instruments

Texas Instruments CC1350F128RGZR is a 32-bit microcontroller with 131072 ROM words, 28672 RAM bytes, and 8-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers connectivity via I2C, I2S, SSI(2), UART and features peripherals like COMPARATOR(2) and DMA(32).

Median Price

$7.295

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,138 parts In-Stock

1+ parts

$5.910

100+ parts

$4.818

1k+ parts

$3.212

10k+ parts

-

19,138

$5.910

$4.818

$3.212

-

DigiKey

USA . 2,060 parts In-Stock

1+ parts

$8.680

100+ parts

$6.578

1k+ parts

$5.799

10k+ parts

$5.530

2,060

$8.680

$6.578

$5.799

$5.530

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.818

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.818

-

-

-

Digiode

USA . 4,140 parts In-Stock

1+ parts

$5.614

100+ parts

-

1k+ parts

-

10k+ parts

-

4,140

$5.614

-

-

-

Chip Stock

USA . 14,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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14,513

-

-

-

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Vyrian

USA . 10,444 parts In-Stock

1+ parts

-

100+ parts

-

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-

10,444

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,196 parts In-Stock

1+ parts

$4.818

100+ parts

-

1k+ parts

-

10k+ parts

$4.722

4,196

$4.818

-

-

$4.722

Ampacity Inc.

Singapore . 10,390 parts In-Stock

1+ parts

$5.020

100+ parts

-

1k+ parts

-

10k+ parts

-

10,390

$5.020

-

-

-

Corphita

USA . 2,470 parts In-Stock

1+ parts

$5.319

100+ parts

-

1k+ parts

-

10k+ parts

-

2,470

$5.319

-

-

-

Parana Technologies

USA . 1,619 parts In-Stock

1+ parts

$41.211

100+ parts

-

1k+ parts

-

10k+ parts

-

1,619

$41.211

-

-

-

ChromeModa Solutions

Germany . 2,495 parts In-Stock

1+ parts

$46.304

100+ parts

$37.969

1k+ parts

-

10k+ parts

-

2,495

$46.304

$37.969

-

-

IDEA Electronic Components Group

UK . 1,710 parts In-Stock

1+ parts

$46.304

100+ parts

$43.989

1k+ parts

$41.674

10k+ parts

-

1,710

$46.304

$43.989

$41.674

-

Corohmni

South Africa . 1,213 parts In-Stock

1+ parts

$50.989

100+ parts

-

1k+ parts

-

10k+ parts

-

1,213

$50.989

-

-

-

Authorized Procurement Solutions

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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30,000

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-

-

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Kepictronics

USA . 13,826 parts In-Stock

1+ parts

-

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13,826

-

-

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Lixinc

USA . 10,852 parts In-Stock

1+ parts

-

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10,852

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-

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A-Z Elektronik GmbH

Germany . 5,042 parts In-Stock

1+ parts

-

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5,042

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-

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Argo Parts USA

USA . 3,790 parts In-Stock

1+ parts

-

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3,790

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-

-

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Alle Elektronik GmbH

Germany . 3,361 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,361

-

-

-

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S.R.D Solutions

India . 2,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,320

-

-

-

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DigiPath Technology Company

USA . 687 parts In-Stock

1+ parts

-

100+ parts

$41.748

1k+ parts

-

10k+ parts

-

687

-

$41.748

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$4.722

1k+ parts

$4.577

10k+ parts

$4.481

500

-

$4.722

$4.577

$4.481

Overview

Discover the CC1350F128RGZR by Texas Instruments, a high-quality microcontroller that offers unmatched reliability and performance. With its advanced technology and innovative features, this product is perfect for a wide range of applications in various industries. From industrial automation to IoT devices, this microcontroller provides exceptional value, benefits, and advantages to customers looking for top-notch performance and efficiency. Trust Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact design, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.8 V

Ability to handle higher supply voltage provides flexibility in power requirements for different applications.

Minimum Supply Voltage: 1.8 V

Support for low supply voltage enables energy-efficient operation and extended battery life.

ADC Channels: YES

Integrated Analog-to-Digital Converters simplify the process of interfacing with analog sensors or signals.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and offload the CPU for improved system performance.

ROM Words: 131072

Large Read-Only Memory capacity allows for storing substantial program code and data, enabling complex applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables high performance and efficiency in processing instructions, suitable for real-time applications.

RAM Bytes: 28672

Ample Random Access Memory size facilitates data storage and manipulation, supporting multitasking and data-intensive applications.

PWM Channels: YES

Pulse-Width Modulation channels enable precise control over output signals, beneficial for applications like motor control and power management.

Connectivity: I2C, I2S, SSI(2), UART

Versatile connectivity options allow seamless integration with various external devices and communication protocols, enhancing interoperability.

Technical Specifications

Microcontrollers CC1350F128RGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

32.768KHZ NOMINAL CRYSTAL CLOCK AVAILABLE

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

30

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SSI(2), UART

Peripherals:

COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

CC1350F128RGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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