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CC1312R74T0RGZR

Texas Instruments

CC1312R74T0RGZR by Texas Instruments

The Texas Instruments CC1312R74T0RGZR microcontroller features a 32-bit Cortex-M4F CPU, 147456 bytes of RAM, and 720896 ROM words. With integrated DAC and ADC channels, it is suitable for applications requiring low power consumption and connectivity via I2C, I2S, SSI, and UART interfaces. Operating b/w -40°C to 105°C with a max clock frequency of 48 MHz makes it ideal for various IoT and sensor-based projects.

Median Price

$6.853

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,709 parts In-Stock

1+ parts

$4.876

100+ parts

$3.975

1k+ parts

$2.650

10k+ parts

-

14,709

$4.876

$3.975

$2.650

-

Mouser Electronics

USA . 2,530 parts In-Stock

1+ parts

$8.830

100+ parts

$5.480

1k+ parts

$4.590

10k+ parts

$4.590

2,530

$8.830

$5.480

$4.590

$4.590

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,651 parts In-Stock

1+ parts

$4.632

100+ parts

-

1k+ parts

-

10k+ parts

-

4,651

$4.632

-

-

-

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$4.983

100+ parts

-

1k+ parts

-

10k+ parts

-

54

$4.983

-

-

-

TME

Poland . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.840

12,500

-

-

-

$3.840

Vyrian

USA . 8,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,386

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 8,282 parts In-Stock

1+ parts

$4.140

100+ parts

$4.036

1k+ parts

$4.016

10k+ parts

-

8,282

$4.140

$4.036

$4.016

-

Ampacity Inc.

Singapore . 8,139 parts In-Stock

1+ parts

$4.140

100+ parts

-

1k+ parts

-

10k+ parts

-

8,139

$4.140

-

-

-

Corphita

USA . 457 parts In-Stock

1+ parts

$4.388

100+ parts

-

1k+ parts

-

10k+ parts

-

457

$4.388

-

-

-

Continental Prestige Electronics

USA . 792 parts In-Stock

1+ parts

$4.983

100+ parts

-

1k+ parts

-

10k+ parts

$4.883

792

$4.983

-

-

$4.883

Netroflash

USA . 100 parts In-Stock

1+ parts

$4.983

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.983

-

-

-

Parana Technologies

USA . 1,331 parts In-Stock

1+ parts

$48.243

100+ parts

$4,480.126

1k+ parts

$43.419

10k+ parts

-

1,331

$48.243

$4,480.126

$43.419

-

DigiPath Technology Company

USA . 425 parts In-Stock

1+ parts

$53.122

100+ parts

$48.872

1k+ parts

-

10k+ parts

-

425

$53.122

$48.872

-

-

ChromeModa Solutions

Germany . 4,180 parts In-Stock

1+ parts

$54.206

100+ parts

$44.449

1k+ parts

-

10k+ parts

-

4,180

$54.206

$44.449

-

-

IDEA Electronic Components Group

UK . 234 parts In-Stock

1+ parts

$54.206

100+ parts

$51.496

1k+ parts

$48.785

10k+ parts

-

234

$54.206

$51.496

$48.785

-

Corohmni

South Africa . 67 parts In-Stock

1+ parts

$80.867

100+ parts

-

1k+ parts

-

10k+ parts

-

67

$80.867

-

-

-

Lixinc

USA . 9,541 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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9,541

-

-

-

-

Argo Parts USA

USA . 986 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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986

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the Texas Instruments CC1312R74T0RGZR microcontroller. Crafted by industry leaders, this innovative device boasts seamless integration, high performance, and unparalleled reliability. From smart appliances to wearable tech, this versatile microcontroller caters to a wide range of applications, delivering exceptional value and efficiency to customers. Stay ahead of the curve and elevate your projects with the Texas Instruments CC1312R74T0RGZR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Integrated Cache: YES

Allows for faster data access and processing, enhancing overall performance.

Maximum Supply Voltage: 3.8 V

Provides a wide range of operating voltage, making it versatile for different applications.

CPU Family: CORTEX-M4F

Belongs to a powerful and efficient CPU family, ensuring high performance and energy efficiency.

Analog To Digital Convertors: 8-Ch 12-Bit

Enables precise analog to digital conversion for accurate sensor readings and control purposes.

Maximum Clock Frequency: 48 MHz

Provides high processing speed, making it suitable for applications requiring quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a reduced instruction set computing architecture for improved efficiency and performance.

RAM Bytes: 147456

Offers a large amount of memory for data storage and processing, accommodating complex algorithms and applications.

Connectivity: I2C, I2S, SSI(2), UART(2)

Supports various communication protocols, enabling seamless integration with other devices and systems.

Low Power Mode: YES

Allows for power-efficient operation, extending battery life in portable or energy-conscious applications.

Technical Specifications

Microcontrollers CC1312R74T0RGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

147456

ROM Words:

720896

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SSI(2), UART(2)

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

CC1312R74T0RGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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