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CC1352P1F3RGZT

Texas Instruments

CC1352P1F3RGZT by Texas Instruments

The Texas Instruments CC1352P1F3RGZT is a 32-bit microcontroller with 81920 bytes of RAM and Flash ROM programmability. It features 26 I/O lines, ADC and DMA channels, and PWM support. Ideal for industrial applications requiring a temperature range of -40 to 85°C, it comes in a square chip carrier package with very thin profile.

Median Price

$11.280

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,238 parts In-Stock

1+ parts

$8.466

100+ parts

$7.395

1k+ parts

$5.100

10k+ parts

-

1,238

$8.466

$7.395

$5.100

-

Mouser Electronics

USA . 1,852 parts In-Stock

1+ parts

$11.280

100+ parts

$8.400

1k+ parts

$6.960

10k+ parts

-

1,852

$11.280

$8.400

$6.960

-

DigiKey

USA . 1,524 parts In-Stock

1+ parts

$11.280

100+ parts

$8.576

1k+ parts

$7.690

10k+ parts

$7.489

1,524

$11.280

$8.576

$7.690

$7.489

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 64 parts In-Stock

1+ parts

$7.400

100+ parts

-

1k+ parts

-

10k+ parts

-

64

$7.400

-

-

-

Digiode

USA . 3,142 parts In-Stock

1+ parts

$8.043

100+ parts

-

1k+ parts

-

10k+ parts

-

3,142

$8.043

-

-

-

Dynamic Solutions

Germany . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,500

-

-

-

-

Vyrian

USA . 1,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,852

-

-

-

-

Bristol Electronics

USA . 162 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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162

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,746 parts In-Stock

1+ parts

$7.200

100+ parts

-

1k+ parts

-

10k+ parts

-

1,746

$7.200

-

-

-

Semicontronic

India . 1,601 parts In-Stock

1+ parts

$7.200

100+ parts

$7.020

1k+ parts

$6.984

10k+ parts

-

1,601

$7.200

$7.020

$6.984

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$7.400

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$7.400

-

-

-

Corphita

USA . 1,328 parts In-Stock

1+ parts

$7.619

100+ parts

-

1k+ parts

-

10k+ parts

-

1,328

$7.619

-

-

-

Parana Technologies

USA . 2,275 parts In-Stock

1+ parts

$54.605

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

$54.605

-

-

-

ChromeModa Solutions

Germany . 2,273 parts In-Stock

1+ parts

$61.354

100+ parts

$50.310

1k+ parts

-

10k+ parts

-

2,273

$61.354

$50.310

-

-

IDEA Electronic Components Group

UK . 438 parts In-Stock

1+ parts

$61.354

100+ parts

$58.286

1k+ parts

$55.219

10k+ parts

-

438

$61.354

$58.286

$55.219

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$63.668

100+ parts

$57.938

1k+ parts

$52.208

10k+ parts

-

5,000

$63.668

$57.938

$52.208

-

Corohmni

South Africa . 332 parts In-Stock

1+ parts

$81.212

100+ parts

-

1k+ parts

-

10k+ parts

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332

$81.212

-

-

-

Argo Parts USA

USA . 4,724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,724

-

-

-

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Continental Prestige Electronics

USA . 4,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,245

-

-

-

-

DigiPath Technology Company

USA . 1,701 parts In-Stock

1+ parts

-

100+ parts

$55.317

1k+ parts

-

10k+ parts

-

1,701

-

$55.317

-

-

Overview

Unlock the power of seamless connectivity and precision control with the Texas Instruments CC1352P1F3RGZT microcontroller. Crafted by a leader in semiconductor innovation, this versatile chip delivers unparalleled performance in a compact square package. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller boasts advanced features like ADC and DMA channels for enhanced functionality. Experience the reliability and efficiency that Texas Instruments is known for, and revolutionize your designs with the CC1352P1F3RGZT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for efficient assembly onto PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 3.8 V

Provides a wide range of voltage compatibility for various applications.

Package Shape: SQUARE

Square shape makes it easier to handle and design with in PCB layouts.

Bit Size: 32

32-bit architecture enables higher processing capability and efficiency.

No. of Terminals: 48

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This style combination allows for effective heat dissipation and space-saving design.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage makes it suitable for energy-efficient applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency for processing data.

RAM Bytes: 81920

Large RAM capacity allows for handling of complex computations and tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

ROM Programmability: FLASH

Flash memory enables easy reprogramming and updating of firmware.

Technical Specifications

Microcontrollers CC1352P1F3RGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

81920

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

CC1352P1F3RGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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