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CC1350F128RHBT

Texas Instruments

CC1350F128RHBT by Texas Instruments

Texas Instruments CC1350F128RHBT is a 32-bit microcontroller with 131072 ROM words, 28672 RAM bytes, and 8-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers connectivity via I2C, I2S, SSI(2), UART and features peripherals like DMA(32) and RTC. With a temperature range of -40 to 85 °C, this CMOS technology-based chip is suitable for various IoT devices.

Median Price

$9.732

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,750 parts In-Stock

1+ parts

$7.805

100+ parts

$6.363

1k+ parts

$4.242

10k+ parts

-

1,750

$7.805

$6.363

$4.242

-

Mouser Electronics

USA . 61 parts In-Stock

1+ parts

$11.660

100+ parts

$7.370

1k+ parts

$6.040

10k+ parts

-

61

$11.660

$7.370

$6.040

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$5.290

100+ parts

-

1k+ parts

-

10k+ parts

-

76

$5.290

-

-

-

Digiode

USA . 3,554 parts In-Stock

1+ parts

$7.415

100+ parts

-

1k+ parts

-

10k+ parts

-

3,554

$7.415

-

-

-

Vyrian

USA . 4,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,584

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,226 parts In-Stock

1+ parts

$5.290

100+ parts

-

1k+ parts

-

10k+ parts

$5.184

4,226

$5.290

-

-

$5.184

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.290

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$5.290

-

-

-

Ampacity Inc.

Singapore . 524 parts In-Stock

1+ parts

$6.630

100+ parts

-

1k+ parts

-

10k+ parts

-

524

$6.630

-

-

-

Corphita

USA . 2,469 parts In-Stock

1+ parts

$7.024

100+ parts

-

1k+ parts

-

10k+ parts

-

2,469

$7.024

-

-

-

Parana Technologies

USA . 1,631 parts In-Stock

1+ parts

$66.178

100+ parts

-

1k+ parts

-

10k+ parts

-

1,631

$66.178

-

-

-

DigiPath Technology Company

USA . 1,101 parts In-Stock

1+ parts

$72.870

100+ parts

$67.040

1k+ parts

-

10k+ parts

-

1,101

$72.870

$67.040

-

-

ChromeModa Solutions

Germany . 4,529 parts In-Stock

1+ parts

$74.357

100+ parts

$60.973

1k+ parts

-

10k+ parts

-

4,529

$74.357

$60.973

-

-

IDEA Electronic Components Group

UK . 60 parts In-Stock

1+ parts

$74.357

100+ parts

$70.639

1k+ parts

$66.921

10k+ parts

-

60

$74.357

$70.639

$66.921

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Lixinc

USA . 8,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,440

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Argo Parts USA

USA . 1,463 parts In-Stock

1+ parts

-

100+ parts

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1,463

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Perfect Parts

USA . 560 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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560

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Overview

Unlock a world of possibilities with the Texas Instruments CC1350F128RHBT microcontroller. Manufactured to the highest standards, this versatile chip offers unparalleled performance and reliability for a wide range of applications. From smart home devices to industrial sensors, this microcontroller's advanced features, low power consumption, and compact design make it the perfect choice for customers looking to take their projects to the next level. Experience innovation like never before with the CC1350F128RHBT by Texas Instruments.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material suitable for various applications.

Surface Mount:

YES - Easy and convenient installation process.

Maximum Supply Voltage:

3.8 V - Provides sufficient power for optimal performance.

Package Shape:

SQUARE - Compact design for space-saving applications.

Bit Size:

32 - High processing capability for complex tasks.

No. of Terminals:

32 - Sufficient connectivity options for peripherals.

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE - Versatile package styles for different mounting options.

Minimum Supply Voltage:

1.8 V - Energy-efficient operation for longer battery life.

Maximum Operating Temperature:

85 °C - High operating temperature tolerance for reliability.

Minimum Operating Temperature:

40 °C - Suitable for use in extreme temperature conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - Corrosion-resistant finish for durability.

ADC Channels:

YES - Allows for analog signal processing.

DMA Channels:

YES - Efficient data transfer capabilities.

Terminal Position:

QUAD - Easy component orientation for PCB layout.

ROM Words:

131072 - Large memory capacity for storing program data.

Maximum Seated Height:

1 mm - Low profile design for compact devices.

Width:

5 mm - Slim form factor for space-constrained applications.

Peripherals:

COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT - Wide range of built-in peripheral options.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly.

Peak Reflow Temperature °C:

260 - Suitable for lead-free soldering processes.

Length:

5 mm - Compact size for versatile integration.

Temperature Grade:

INDUSTRIAL - Industrial-grade reliability for rugged environments.

Peripheral IC Type:

MICROCONTROLLER, RISC - Advanced processing architecture for efficiency.

RAM Bytes:

28672 - Sufficient memory for data storage and processing.

Technology:

CMOS - Energy-efficient technology for improved battery life.

Terminal Form:

NO LEAD - Lead-free terminal design for environmental compliance.

Analog To Digital Convertors:

8-Ch 12-Bit - High-quality signal conversion for accurate data processing.

Nominal Supply Voltage:

3 V - Standard voltage for compatibility with various systems.

PWM Channels:

YES - Allows for precise control of output signals.

Connectivity:

I2C, I2S, SSI(2), UART - Versatile communication interfaces for connectivity.

ROM Programmability:

FLASH - Flexibility for program updates and modifications.

Terminal Pitch:

0.5 mm - Fine pitch for high-density PCB layouts.

Moisture Sensitivity Level (MSL):

3 - Suitable for standard moisture exposure levels.

Speed:

48 rpm - Efficient processing speed for responsive performance.

On Chip Program ROM Width:

8 - Wide data path for faster program execution.

No. of I/O Lines:

15 - Sufficient input/output options for connectivity.

Technical Specifications

Microcontrollers CC1350F128RHBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

32.768KHZ NOMINAL CRYSTAL CLOCK AVAILABLE

Address Bus Width:

0

Bit Size:

32

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

15

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

28672

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SSI(2), UART

Peripherals:

COMPARATOR(2), DMA(32), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

CC1350F128RHBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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