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CC1311R31T0RGZR

Texas Instruments

CC1311R31T0RGZR by Texas Instruments

The Texas Instruments CC1311R31T0RGZR microcontroller features a 32-bit Cortex-M4 CPU, 48 MHz clock frequency, and 32768 bytes of RAM. Ideal for applications requiring low power consumption, it offers connectivity options like I2C, I2S, SSI, and UART. With integrated cache and DMA channels, this chip is suitable for IoT devices and sensor networks.

Median Price

$6.134

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,081 parts In-Stock

1+ parts

$4.048

100+ parts

$3.300

1k+ parts

$2.200

10k+ parts

-

8,081

$4.048

$3.300

$2.200

-

Mouser Electronics

USA . 4,470 parts In-Stock

1+ parts

$8.220

100+ parts

$4.760

1k+ parts

$4.040

10k+ parts

$3.430

4,470

$8.220

$4.760

$4.040

$3.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 795 parts In-Stock

1+ parts

$3.846

100+ parts

-

1k+ parts

-

10k+ parts

-

795

$3.846

-

-

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Vyrian

USA . 1,102 parts In-Stock

1+ parts

$4.048

100+ parts

-

1k+ parts

-

10k+ parts

-

1,102

$4.048

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,814 parts In-Stock

1+ parts

$3.440

100+ parts

$3.354

1k+ parts

$3.337

10k+ parts

-

4,814

$3.440

$3.354

$3.337

-

Corphita

USA . 4,707 parts In-Stock

1+ parts

$3.643

100+ parts

-

1k+ parts

-

10k+ parts

-

4,707

$3.643

-

-

-

Corohmni

South Africa . 481 parts In-Stock

1+ parts

$4.048

100+ parts

-

1k+ parts

-

10k+ parts

-

481

$4.048

-

-

-

Ampacity Inc.

Singapore . 5,136 parts In-Stock

1+ parts

$7.490

100+ parts

-

1k+ parts

-

10k+ parts

-

5,136

$7.490

-

-

-

Parana Technologies

USA . 731 parts In-Stock

1+ parts

$46.692

100+ parts

-

1k+ parts

-

10k+ parts

-

731

$46.692

-

-

-

DigiPath Technology Company

USA . 1,675 parts In-Stock

1+ parts

$51.414

100+ parts

$47.301

1k+ parts

-

10k+ parts

-

1,675

$51.414

$47.301

-

-

IDEA Electronic Components Group

UK . 1,457 parts In-Stock

1+ parts

$52.463

100+ parts

$49.840

1k+ parts

$47.217

10k+ parts

-

1,457

$52.463

$49.840

$47.217

-

ChromeModa Solutions

Germany . 1,208 parts In-Stock

1+ parts

$52.463

100+ parts

$43.020

1k+ parts

-

10k+ parts

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1,208

$52.463

$43.020

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-

Northwest PG Solutions

USA . 2,096 parts In-Stock

1+ parts

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2,096

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iodParts Technologies Inc.

India . 180 parts In-Stock

1+ parts

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180

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Native Components

USA . 61 parts In-Stock

1+ parts

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61

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Overview

Experience unmatched performance and reliability with the CC1311R31T0RGZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that excel in a wide range of applications. From consumer electronics to industrial automation, this versatile chip offers exceptional value, benefits, and advantages to customers. Trust Texas Instruments to provide cutting-edge technology that meets your every need, ensuring seamless functionality and superior performance. Elevate your projects with the CC1311R31T0RGZR and unleash innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of environmental conditions.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by reducing access time to frequently used instructions and data.

Maximum Supply Voltage: 3.8 V

This high voltage tolerance allows the microcontroller to operate reliably in systems with varying supply voltages.

CPU Family: CORTEX-M4

The Cortex-M4 family is known for its high performance and energy efficiency, making it a good choice for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance computing with reduced complexity, making it suitable for real-time applications.

Maximum Clock Frequency: 48 MHz

The high clock frequency allows for fast processing of instructions and data, making the microcontroller suitable for applications that require high performance.

ADC Channels: YES

The Analog to Digital Converter channels enable the microcontroller to interface with analog sensors and devices, expanding its usability in data acquisition applications.

Peripherals: BOD, COMPARATOR, DMA(32), POR, RTC, TIMER(5), WDT

Having a variety of peripherals like Brown-Out Detector, DMA, Real-Time Clock, Timers, and Watchdog Timer enhances the functionality and versatility of the microcontroller for different applications.

Technical Specifications

Microcontrollers CC1311R31T0RGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

48 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

30

No. of Serial I/Os:

1

No. of Terminals:

48

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

360448

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, SSI, UART

Peripherals:

BOD, COMPARATOR, DMA(32), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

Trade Compliance

CC1311R31T0RGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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