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CAVCB164245MDGGEP

Texas Instruments

CAVCB164245MDGGEP by Texas Instruments

Texas Instruments CAVCB164245MDGGEP is a 48-terminal bus driver with 12.8ns propagation delay, operating at 1.5/3.3V for bidirectional communication in military-grade applications. The device features a small outline package and supports up to 12 Amp output current with true output polarity, making it suitable for high-performance systems requiring fast signal translation.

Median Price

$14.166

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,228 parts In-Stock

1+ parts

$9.601

100+ parts

$8.387

1k+ parts

$5.784

10k+ parts

-

6,228

$9.601

$8.387

$5.784

-

Mouser Electronics

USA . 85 parts In-Stock

1+ parts

$18.730

100+ parts

$13.880

1k+ parts

$11.990

10k+ parts

-

85

$18.730

$13.880

$11.990

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,999 parts In-Stock

1+ parts

$9.121

100+ parts

-

1k+ parts

-

10k+ parts

-

1,999

$9.121

-

-

-

Vyrian

USA . 5,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,715

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 841 parts In-Stock

1+ parts

$0.884

100+ parts

-

1k+ parts

-

10k+ parts

-

841

$0.884

-

-

-

Northwest PG Solutions

USA . 769 parts In-Stock

1+ parts

$0.972

100+ parts

-

1k+ parts

-

10k+ parts

-

769

$0.972

-

-

-

Andel Nordic

Denmark . 2,471 parts In-Stock

1+ parts

$4.106

100+ parts

-

1k+ parts

$3.941

10k+ parts

$3.941

2,471

$4.106

-

$3.941

$3.941

Corphita

USA . 343 parts In-Stock

1+ parts

$8.641

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$8.641

-

-

-

Parana Technologies

USA . 89 parts In-Stock

1+ parts

$12.075

100+ parts

-

1k+ parts

$12.485

10k+ parts

-

89

$12.075

-

$12.485

-

DigiPath Technology Company

USA . 20 parts In-Stock

1+ parts

$13.296

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$13.296

-

-

-

ChromeModa Solutions

Germany . 3,521 parts In-Stock

1+ parts

$13.567

100+ parts

$11.125

1k+ parts

-

10k+ parts

-

3,521

$13.567

$11.125

-

-

IDEA Electronic Components Group

UK . 1,634 parts In-Stock

1+ parts

$13.567

100+ parts

$12.889

1k+ parts

$12.210

10k+ parts

-

1,634

$13.567

$12.889

$12.210

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Lixinc

USA . 17,472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,472

-

-

-

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Component Stockers USA

USA . 4,464 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,464

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Overview

Discover the cutting-edge CAVCB164245MDGGEP by Texas Instruments, a top-tier Bus Driver & Transceivers device designed with precision and reliability in mind. With Texas Instruments' stellar reputation for quality, this product ensures optimal performance in various applications. Whether you're in need of seamless signal translation or efficient bus driving capabilities, this versatile component delivers. Experience the value of smooth operation, enhanced functionality, and dependable results with the CAVCB164245MDGGEP. Elevate your projects to new heights with Texas Instruments' superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product durable and resistant to environmental factors, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 12.8 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed data transfer applications.

Surface Mount: YES

Surface mount capability simplifies the installation process and saves space on the PCB, making it ideal for compact electronic designs.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and reduces the need for additional components, streamlining the design.

Nominal Supply Voltage / Vsup (V): 1.5

Operating at a low supply voltage of 1.5V reduces power consumption and heat generation, making the product energy-efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Bus Driver & Transceivers CAVCB164245MDGGEP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

12.8 ns

Propagation Delay (tpd):

12.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

6.1 mm

Trade Compliance

CAVCB164245MDGGEP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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