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CAVCH4T245MRSVREP

Texas Instruments

CAVCH4T245MRSVREP by Texas Instruments

CAVCH4T245MRSVREP by Texas Instruments is a 4-bit bus driver with propagation delay of 10.3 ns, operating at a supply voltage of 1.5V. It features true output polarity and supports bidirectional communication in military-grade applications. The chip carrier package has a very thin profile, making it suitable for compact designs requiring fast signal translation.

Median Price

$2.924

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 3,050 parts In-Stock

1+ parts

$2.914

100+ parts

$2.300

1k+ parts

$1.763

10k+ parts

$1.758

3,050

$2.914

$2.300

$1.763

$1.758

Arrow

USA . 62 parts In-Stock

1+ parts

$2.933

100+ parts

$2.139

1k+ parts

-

10k+ parts

-

62

$2.933

$2.139

-

-

Texas Instruments

USA . 44,502 parts In-Stock

1+ parts

$3.080

100+ parts

$2.544

1k+ parts

$1.375

10k+ parts

-

44,502

$3.080

$2.544

$1.375

-

Rochester

USA . 4,183 parts In-Stock

1+ parts

-

100+ parts

$2.280

1k+ parts

$2.040

10k+ parts

$1.920

4,183

-

$2.280

$2.040

$1.920

DigiKey

USA . 4,183 parts In-Stock

1+ parts

-

100+ parts

$3.000

1k+ parts

-

10k+ parts

-

4,183

-

$3.000

-

-

Verical

USA . 2,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.550

10k+ parts

$2.400

2,150

-

-

$2.550

$2.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,947 parts In-Stock

1+ parts

$1.814

100+ parts

-

1k+ parts

-

10k+ parts

-

1,947

$1.814

-

-

-

Vyrian

USA . 2,264 parts In-Stock

1+ parts

$1.910

100+ parts

-

1k+ parts

-

10k+ parts

-

2,264

$1.910

-

-

-

Netsource Technology, Inc.

USA . 6,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,252

-

-

-

-

Sensible Micro Corp

USA . 272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

272

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,902 parts In-Stock

1+ parts

$1.719

100+ parts

-

1k+ parts

-

10k+ parts

-

4,902

$1.719

-

-

-

Andel Nordic

Denmark . 860 parts In-Stock

1+ parts

$5.322

100+ parts

-

1k+ parts

$5.110

10k+ parts

$5.110

860

$5.322

-

$5.110

$5.110

Parana Technologies

USA . 910 parts In-Stock

1+ parts

$22.619

100+ parts

-

1k+ parts

$23.278

10k+ parts

-

910

$22.619

-

$23.278

-

DigiPath Technology Company

USA . 2,022 parts In-Stock

1+ parts

$24.907

100+ parts

$22.914

1k+ parts

-

10k+ parts

-

2,022

$24.907

$22.914

-

-

IDEA Electronic Components Group

UK . 583 parts In-Stock

1+ parts

$25.415

100+ parts

$24.144

1k+ parts

$22.874

10k+ parts

-

583

$25.415

$24.144

$22.874

-

ChromeModa Solutions

Germany . 465 parts In-Stock

1+ parts

$25.415

100+ parts

$20.840

1k+ parts

-

10k+ parts

-

465

$25.415

$20.840

-

-

Native Components

USA . 65 parts In-Stock

1+ parts

$493.719

100+ parts

$483.845

1k+ parts

$478.907

10k+ parts

$473.970

65

$493.719

$483.845

$478.907

$473.970

Northwest PG Solutions

USA . 1,248 parts In-Stock

1+ parts

$543.091

100+ parts

-

1k+ parts

-

10k+ parts

-

1,248

$543.091

-

-

-

Kepictronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Overview

Elevate your electronic designs with the Texas Instruments CAVCH4T245MRSVREP, a top-of-the-line bus driver & transceiver. Crafted with precision and quality by a trusted manufacturer, this versatile chip carrier offers seamless translation capabilities between different voltage levels, making it ideal for a wide range of applications. With a very thin profile and impressive 3-state output characteristics, this military-grade component ensures reliable performance even in extreme conditions. Upgrade your projects with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 10.3 ns

The low propagation delay ensures efficient signal transmission, enhancing the overall performance of the product.

Surface Mount: YES

Being surface mountable allows for easy and quick installation, saving time and effort during the assembly process.

Nominal Supply Voltage: 1.5V

The low nominal supply voltage helps in reducing power consumption and increasing efficiency.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state, providing flexibility in controlling the bus driver and transceiver.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product reliable and energy-efficient.

Technical Specifications

Bus Driver & Transceivers CAVCH4T245MRSVREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.016 mA

Propagation Delay At Nominal Supply:

10.3 ns

Propagation Delay (tpd):

10.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

1.8 mm

Trade Compliance

CAVCH4T245MRSVREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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