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CAVCB164245MDGGREP

Texas Instruments

CAVCB164245MDGGREP by Texas Instruments

CAVCB164245MDGGREP by Texas Instruments is a bus driver & transceiver with 8 bits, 12.8 ns propagation delay, and 1.5/3.3V translation for military applications. It features a small outline package style, dual terminal position, and common control for bidirectional communication in harsh environments at temperatures ranging from -55 to 125 °C.

Median Price

$13.840

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23,674 parts In-Stock

1+ parts

$8.869

100+ parts

$7.230

1k+ parts

$4.820

10k+ parts

-

23,674

$8.869

$7.230

$4.820

-

Mouser Electronics

USA . 1,805 parts In-Stock

1+ parts

$18.810

100+ parts

$12.070

1k+ parts

$10.020

10k+ parts

$9.750

1,805

$18.810

$12.070

$10.020

$9.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,415 parts In-Stock

1+ parts

$8.426

100+ parts

-

1k+ parts

-

10k+ parts

-

3,415

$8.426

-

-

-

Vyrian

USA . 1,610 parts In-Stock

1+ parts

$8.869

100+ parts

-

1k+ parts

-

10k+ parts

-

1,610

$8.869

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 189 parts In-Stock

1+ parts

$2.102

100+ parts

-

1k+ parts

-

10k+ parts

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189

$2.102

-

-

-

Northwest PG Solutions

USA . 1,327 parts In-Stock

1+ parts

$2.313

100+ parts

-

1k+ parts

-

10k+ parts

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1,327

$2.313

-

-

-

Andel Nordic

Denmark . 3,878 parts In-Stock

1+ parts

$4.420

100+ parts

-

1k+ parts

$4.244

10k+ parts

$4.244

3,878

$4.420

-

$4.244

$4.244

Corphita

USA . 1,306 parts In-Stock

1+ parts

$7.982

100+ parts

-

1k+ parts

-

10k+ parts

-

1,306

$7.982

-

-

-

Corohmni

South Africa . 487 parts In-Stock

1+ parts

$24.819

100+ parts

-

1k+ parts

-

10k+ parts

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487

$24.819

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$27.005

100+ parts

$24.575

1k+ parts

$22.144

10k+ parts

-

2,500

$27.005

$24.575

$22.144

-

Parana Technologies

USA . 840 parts In-Stock

1+ parts

$27.006

100+ parts

-

1k+ parts

$31.119

10k+ parts

-

840

$27.006

-

$31.119

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DigiPath Technology Company

USA . 1,859 parts In-Stock

1+ parts

$29.737

100+ parts

-

1k+ parts

-

10k+ parts

-

1,859

$29.737

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-

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ChromeModa Solutions

Germany . 4,348 parts In-Stock

1+ parts

$30.344

100+ parts

$24.882

1k+ parts

-

10k+ parts

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4,348

$30.344

$24.882

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-

IDEA Electronic Components Group

UK . 529 parts In-Stock

1+ parts

$30.344

100+ parts

$28.827

1k+ parts

$27.310

10k+ parts

-

529

$30.344

$28.827

$27.310

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Lixinc

USA . 11,839 parts In-Stock

1+ parts

-

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11,839

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

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7,500

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Kepictronics

USA . 3,250 parts In-Stock

1+ parts

-

100+ parts

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3,250

-

-

-

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Overview

Experience the superior quality and reliability of Texas Instruments with the CAVCB164245MDGGREP bus driver & transceiver. This versatile component offers seamless integration, efficient performance, and exceptional value for a wide range of applications. With advanced technology and precise design, this product ensures optimal functionality and durability, making it the perfect choice for your electronic projects. Trust in Texas Instruments to deliver cutting-edge solutions for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for long-lasting use in various environmental conditions.

Propagation Delay At Nominal Supply: 12.8 ns

Fast signal propagation ensures quick response times in bus driver applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort in production.

No. of Functions: 2

Multi-functional device capable of handling complex communication tasks efficiently.

No. of Bits: 8

Provides sufficient data handling capability for bus communication.

Nominal Supply Voltage / Vsup (V): 1.5

Optimal supply voltage for reliable and stable operation.

Load Capacitance (CL): 15 pF

Suitable for driving capacitive loads in bus systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial applications.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Maximum Supply Voltage (Vsup): 3.6 V

Wide supply voltage range for versatility in different applications.

Technical Specifications

Bus Driver & Transceivers CAVCB164245MDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

12.8 ns

Propagation Delay (tpd):

12.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

1.5/3.3V&1.5/3.3V

Width:

6.1 mm

Trade Compliance

CAVCB164245MDGGREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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