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CALVC164245MDGGREP

Texas Instruments

CALVC164245MDGGREP by Texas Instruments

CALVC164245MDGGREP by Texas Instruments is a bus driver & transceiver with 8-bit translation for 3V & 5V, featuring propagation delay of 6.8 ns and output polarity TRUE. Ideal for military applications due to its MILITARY temperature grade, it has a small outline package style with dual terminal position and common control.

Median Price

$4.329

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 71,484 parts In-Stock

1+ parts

$4.267

100+ parts

$3.479

1k+ parts

$2.319

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-

71,484

$4.267

$3.479

$2.319

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Chip1Stop

Japan . 1,307 parts In-Stock

1+ parts

$4.329

100+ parts

$3.202

1k+ parts

$2.970

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1,307

$4.329

$3.202

$2.970

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Arrow

USA . 99 parts In-Stock

1+ parts

$5.857

100+ parts

$4.246

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-

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99

$5.857

$4.246

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DigiKey

USA . 2,302 parts In-Stock

1+ parts

$8.170

100+ parts

$5.396

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-

10k+ parts

$4.760

2,302

$8.170

$5.396

-

$4.760

Mouser Electronics

USA . 582 parts In-Stock

1+ parts

$8.170

100+ parts

$5.400

1k+ parts

$5.100

10k+ parts

$4.740

582

$8.170

$5.400

$5.100

$4.740

Verical

USA . 99 parts In-Stock

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-

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$4.246

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99

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$4.246

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Rochester

USA . 6 parts In-Stock

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-

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$3.840

1k+ parts

$3.430

10k+ parts

$3.230

6

-

$3.840

$3.430

$3.230

Distributors (In-Stock)

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Nova Conductors

Japan . 26 parts In-Stock

1+ parts

$3.170

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26

$3.170

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Digiode

USA . 3,408 parts In-Stock

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$3.515

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$3.515

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Vyrian

USA . 11,209 parts In-Stock

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Component Sense

UK . 1,885 parts In-Stock

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R&J Components

USA . 178 parts In-Stock

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QIE Inc.

USA . 43 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 138 parts In-Stock

1+ parts

$2.309

100+ parts

-

1k+ parts

$2.217

10k+ parts

$2.217

138

$2.309

-

$2.217

$2.217

Ampacity Inc.

Singapore . 11,085 parts In-Stock

1+ parts

$2.520

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$2.520

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Continental Prestige Electronics

USA . 5,220 parts In-Stock

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$3.170

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$3.106

5,220

$3.170

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$3.106

Netroflash

USA . 2,000 parts In-Stock

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$3.170

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$3.106

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2,000

$3.170

$3.106

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Argo Parts USA

USA . 1,446 parts In-Stock

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$3.170

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Corphita

USA . 3,091 parts In-Stock

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$3.330

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$3.330

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Parana Technologies

USA . 1,029 parts In-Stock

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$15.385

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$15.771

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1,029

$15.385

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$15.771

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DigiPath Technology Company

USA . 113 parts In-Stock

1+ parts

$16.940

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113

$16.940

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ChromeModa Solutions

Germany . 5,498 parts In-Stock

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$17.286

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$14.175

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$17.286

$14.175

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IDEA Electronic Components Group

UK . 1,138 parts In-Stock

1+ parts

$17.286

100+ parts

$16.422

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$15.557

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1,138

$17.286

$16.422

$15.557

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Microchip USA

USA . 4,474 parts In-Stock

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$20.649

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Authorized Procurement Solutions

USA . 510,000 parts In-Stock

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Lixinc

USA . 18,204 parts In-Stock

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Kepictronics

USA . 500 parts In-Stock

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Overview

Elevate your electronics projects with the CALVC164245MDGGREP by Texas Instruments, a top-tier manufacturer known for superior quality. This Bus Driver & Transceiver offers seamless translation between 3V and 5V power supplies with lightning-fast propagation delays. Its versatile applications make it a must-have for any tech enthusiast looking to enhance their creations. With precise output characteristics and true output polarity, this component guarantees reliable performance every time. Experience the value and benefits of Texas Instruments' cutting-edge technology with the CALVC164245MDGGREP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures fast signal transmission, making this product ideal for high-speed data communication.

No. of Functions: 2

Having 2 functions in one device makes it efficient and cost-effective for applications requiring multiple functions.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common and widely used supply voltage of 3.3V, compatible with many systems and applications.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, giving flexibility in controlling the bus lines and reducing power consumption.

Technical Specifications

Bus Driver & Transceivers CALVC164245MDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

6.1 mm

Trade Compliance

CALVC164245MDGGREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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