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CALVC164245IZQLREP

Texas Instruments

CALVC164245IZQLREP by Texas Instruments

Texas Instruments CALVC164245IZQLREP is a bus driver with 8-bit capacity, supporting 3V & 5V translation. It features a propagation delay of 5.8 ns and operates at temperatures ranging from -40 to 85 °C. Ideal for industrial applications requiring bidirectional control in a compact package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,504 parts In-Stock

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7,504

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Digiode

USA . 751 parts In-Stock

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751

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,946 parts In-Stock

1+ parts

$6.212

100+ parts

-

1k+ parts

$5.963

10k+ parts

$5.963

1,946

$6.212

-

$5.963

$5.963

AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$9.681

100+ parts

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694

$9.681

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Native Components

USA . 15 parts In-Stock

1+ parts

$18.340

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15

$18.340

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Northwest PG Solutions

USA . 1,489 parts In-Stock

1+ parts

$20.174

100+ parts

$18.157

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1,489

$20.174

$18.157

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Parana Technologies

USA . 967 parts In-Stock

1+ parts

$27.707

100+ parts

-

1k+ parts

$39.027

10k+ parts

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967

$27.707

-

$39.027

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DigiPath Technology Company

USA . 345 parts In-Stock

1+ parts

$30.509

100+ parts

$28.069

1k+ parts

-

10k+ parts

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345

$30.509

$28.069

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ChromeModa Solutions

Germany . 2,489 parts In-Stock

1+ parts

$31.132

100+ parts

$25.528

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2,489

$31.132

$25.528

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IDEA Electronic Components Group

UK . 2,041 parts In-Stock

1+ parts

$31.132

100+ parts

$29.575

1k+ parts

$28.019

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2,041

$31.132

$29.575

$28.019

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One Stop Electronics

USA . 1,505 parts In-Stock

1+ parts

$46.000

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1,505

$46.000

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QUARKTWIN TECHNOLOGY LTD

USA . 21,060 parts In-Stock

1+ parts

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Microchip USA

USA . 2,695 parts In-Stock

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2,695

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Corphita

USA . 2,528 parts In-Stock

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2,528

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$30.884

1k+ parts

$28.599

10k+ parts

$28.599

100

-

$30.884

$28.599

$28.599

Overview

Enhance your electronic designs with the CALVC164245IZQLREP by Texas Instruments, a top-quality bus driver & transceiver that delivers reliable performance and seamless integration. With 3V & 5V translation capabilities, this versatile component offers flexibility in various applications. Upgrade your projects with the advantages of a true 3-state output, minimal propagation delay, and a wide operating temperature range. Trust in Texas Instruments' reputation for excellence and innovation to bring value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in a variety of applications.

Propagation Delay At Nominal Supply: 5.8 ns

The low propagation delay ensures fast signal transmission, making the product efficient and responsive.

Surface Mount: YES

The surface mount feature simplifies installation and integration of the product onto circuit boards, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in one device adds versatility and flexibility to the product, allowing it to perform various tasks efficiently.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to handle, making it compatible with standard board layouts and designs.

No. of Bits: 8

An 8-bit design provides sufficient range and precision for data transmission, making the product suitable for a wide range of applications.

Translation: 3V & 5V

Support for both 3V and 5V voltage translation ensures compatibility with different types of systems, enhancing the product's versatility.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used and provides a stable power source for the product, ensuring reliable performance.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for efficient charging and discharging of the connected components, optimizing signal transmission.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages gives the user flexibility in choosing the appropriate power source for the product.

No. of Terminals: 56

Having 56 terminals provides ample connectivity options, enabling the product to interface with various external devices and components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch allows for a compact and efficient package design, maximizing space utilization on the circuit board.

Maximum I (ol): 24 Amp

The high maximum output current capability of 24 Amps ensures the product can drive power-hungry components or loads effectively.

Propagation Delay (tpd): 7.6 ns

Although slightly higher than the nominal value, the propagation delay of 7.6 ns is still fast enough for quick data transmission, ensuring minimal latency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions and operate reliably in a wide range of applications.

Output Characteristics: 3-STATE

The 3-state output characteristic allows the product to control the bus lines effectively, enabling it to manage data flow efficiently in multi-device communication systems.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, the product can function in cold environments without any performance issues, making it suitable for various industrial applications.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the mounting process and facilitates better heat dissipation, ensuring optimal performance and reliability.

No. of Ports: 2

Featuring two ports allows for simultaneous communication with multiple devices, enhancing the product's connectivity and data exchange capabilities.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm minimizes the overall profile of the product, making it ideal for space-constrained applications.

Width: 4.5 mm

The compact width of 4.5 mm enables easy integration of the product into densely populated circuit boards, increasing system density and scalability.

Output Polarity: TRUE

Having a true output polarity simplifies signal interpretation and processing, ensuring compatibility with other system components and devices.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures the product can operate even under low-power conditions, providing flexibility and reliability in various scenarios.

Length: 7 mm

The compact length of 7 mm allows for a space-efficient design, making the product suitable for applications where size and form factor are critical factors.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade rating, the product is designed to withstand extreme temperatures and harsh environmental conditions commonly found in industrial settings.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of integrated circuits, enhancing the product's performance and reliability.

Terminal Form: BALL

The use of ball terminals simplifies the soldering process, ensuring secure and reliable connections on the circuit board for optimal performance.

Packing Method: TR

The TR (tape and reel) packing method facilitates automated assembly processes, reducing handling errors and improving overall production efficiency.

Terminal Pitch: 0.65 mm

With a fine terminal pitch of 0.65 mm, the product allows for high-density mounting, enabling more connections in a limited space for increased functionality.

Count Direction: BIDIRECTIONAL

Supporting bidirectional data transmission, the product can send and receive signals in both directions, enabling versatile communication capabilities in various applications.

Control Type: COMMON CONTROL

Having a common control type simplifies the operation and management of the product, allowing for centralized control and coordination of multiple functions.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a wide voltage range for the product, accommodating different power supply sources and ensuring compatibility with a variety of systems.

Technical Specifications

Bus Driver & Transceivers CALVC164245IZQLREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PBGA-B56

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Power Supplies (V):

3.3,5

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Translation:

3V & 5V

Width:

4.5 mm

Trade Compliance

CALVC164245IZQLREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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