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CALVC164245IDGGREP

Texas Instruments

CALVC164245IDGGREP by Texas Instruments

CALVC164245IDGGREP by Texas Instruments is a bus driver & transceiver with 8-bit translation for 3V & 5V applications. It features a propagation delay of 5.8 ns, operates at temperatures from -40 to 85 °C, and has a max I (ol) of 24 Amp. This rectangular package with dual terminals is ideal for industrial settings requiring bidirectional control with common control.

Median Price

$5.525

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 19,704 parts In-Stock

1+ parts

$4.684

100+ parts

$4.105

1k+ parts

$2.319

10k+ parts

-

19,704

$4.684

$4.105

$2.319

-

Mouser Electronics

USA . 2,742 parts In-Stock

1+ parts

$6.710

100+ parts

$5.970

1k+ parts

$4.860

10k+ parts

$4.730

2,742

$6.710

$5.970

$4.860

$4.730

Rochester

USA . 1,054 parts In-Stock

1+ parts

-

100+ parts

$4.420

1k+ parts

$3.950

10k+ parts

$3.720

1,054

-

$4.420

$3.950

$3.720

DigiKey

USA . 1,054 parts In-Stock

1+ parts

-

100+ parts

$5.810

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-

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1,054

-

$5.810

-

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Verical

USA . 1,054 parts In-Stock

1+ parts

-

100+ parts

$5.525

1k+ parts

$4.938

10k+ parts

$4.650

1,054

-

$5.525

$4.938

$4.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$3.190

100+ parts

-

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200

$3.190

-

-

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Digiode

USA . 2,064 parts In-Stock

1+ parts

$3.515

100+ parts

-

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2,064

$3.515

-

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Vyrian

USA . 5,826 parts In-Stock

1+ parts

-

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5,826

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Sensible Micro Corp

USA . 1,605 parts In-Stock

1+ parts

-

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1,605

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Sogenti Electronics

Canada . 144 parts In-Stock

1+ parts

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144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,788 parts In-Stock

1+ parts

$2.850

100+ parts

-

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-

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4,788

$2.850

-

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Continental Prestige Electronics

USA . 6,029 parts In-Stock

1+ parts

$3.190

100+ parts

-

1k+ parts

-

10k+ parts

$3.126

6,029

$3.190

-

-

$3.126

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.190

100+ parts

-

1k+ parts

$3.031

10k+ parts

$2.967

1,000

$3.190

-

$3.031

$2.967

Argo Parts USA

USA . 144 parts In-Stock

1+ parts

$3.190

100+ parts

-

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144

$3.190

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Corphita

USA . 1,400 parts In-Stock

1+ parts

$3.330

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1,400

$3.330

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Andel Nordic

Denmark . 1,074 parts In-Stock

1+ parts

$4.225

100+ parts

-

1k+ parts

$4.056

10k+ parts

$4.056

1,074

$4.225

-

$4.056

$4.056

Microchip USA

USA . 3,771 parts In-Stock

1+ parts

$20.649

100+ parts

-

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3,771

$20.649

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Parana Technologies

USA . 271 parts In-Stock

1+ parts

$29.868

100+ parts

$2,773.734

1k+ parts

$26.882

10k+ parts

-

271

$29.868

$2,773.734

$26.882

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DigiPath Technology Company

USA . 558 parts In-Stock

1+ parts

$32.889

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558

$32.889

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ChromeModa Solutions

Germany . 5,456 parts In-Stock

1+ parts

$33.560

100+ parts

$27.519

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5,456

$33.560

$27.519

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IDEA Electronic Components Group

UK . 1,909 parts In-Stock

1+ parts

$33.560

100+ parts

$31.882

1k+ parts

$30.204

10k+ parts

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1,909

$33.560

$31.882

$30.204

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Perfect Parts

USA . 13,761 parts In-Stock

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13,761

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Kepictronics

USA . 8,000 parts In-Stock

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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Lixinc

USA . 7,259 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Overview

Enhance your electronic projects with the CALVC164245IDGGREP by Texas Instruments! As a top-tier manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. This bus driver & transceiver is versatile and efficient, offering seamless translation between 3V and 5V systems with minimal propagation delay. With its compact design and advanced technology, this product ensures optimal performance and smooth operation for all your applications. Experience the value and benefits of this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 5.8 ns

The low propagation delay ensures fast and efficient data transmission, ideal for high-speed communication applications.

Surface Mount: YES

The surface mount capability enables easy integration onto circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in one component helps reduce the overall system complexity and cost.

Package Shape: RECTANGULAR

The rectangular shape makes the product easy to handle and mount on PCBs, enhancing installation efficiency.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data transmission requirements, making it versatile for various applications.

Translation: 3V & 5V

Supporting both 3V and 5V voltage translation allows for compatibility with different systems and ensures reliable signal conversion.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures stable operation and compatibility with common power sources.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures proper signal transmission and reception, enhancing signal integrity.

Power Supplies (V): 3.3,5

Supporting both 3.3V and 5V power supplies provides flexibility in system design and compatibility with various power sources.

Technical Specifications

Bus Driver & Transceivers CALVC164245IDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

2.3V TO 3.6V SUPPLY FOR PORT A

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

3V & 5V

Width:

6.1 mm

Trade Compliance

CALVC164245IDGGREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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