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BUF07703PWPG4

Texas Instruments

BUF07703PWPG4 by Texas Instruments

BUF07703PWPG4 by Texas Instruments is a 20-terminal buffer amplifier with a small outline, heat sink package. It features nickel palladium gold terminal finish and dual terminal position. Ideal for commercial extended temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,993 parts In-Stock

1+ parts

-

100+ parts

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5,993

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Digiode

USA . 3,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,560

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 677 parts In-Stock

1+ parts

$2.522

100+ parts

-

1k+ parts

-

10k+ parts

-

677

$2.522

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-

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Parana Technologies

USA . 1,408 parts In-Stock

1+ parts

$6.340

100+ parts

-

1k+ parts

$7.092

10k+ parts

-

1,408

$6.340

-

$7.092

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DigiPath Technology Company

USA . 150 parts In-Stock

1+ parts

$6.982

100+ parts

-

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-

10k+ parts

-

150

$6.982

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-

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ChromeModa Solutions

Germany . 5,628 parts In-Stock

1+ parts

$7.124

100+ parts

$5.842

1k+ parts

-

10k+ parts

-

5,628

$7.124

$5.842

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IDEA Electronic Components Group

UK . 696 parts In-Stock

1+ parts

$7.124

100+ parts

-

1k+ parts

$6.412

10k+ parts

-

696

$7.124

-

$6.412

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One Stop Electronics

USA . 800 parts In-Stock

1+ parts

$8.410

100+ parts

-

1k+ parts

-

10k+ parts

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800

$8.410

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-

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$18.293

100+ parts

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460

$18.293

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Corphita

USA . 1,156 parts In-Stock

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1,156

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Native Components

USA . 951 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$2.224

10k+ parts

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951

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$2.224

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Overview

Enhance your electronic designs with the high-quality BUF07703PWPG4 buffer amplifier by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers reliable and innovative solutions for various applications. This buffer amplifier offers unmatched value, providing customers with enhanced signal quality and improved performance. Whether you're working on audio equipment, industrial controls, or telecommunications systems, the BUF07703PWPG4 is the perfect choice to take your projects to the next level. Trust Texas Instruments for top-notch products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the internal components of the buffer amplifier, ensuring a longer lifespan.

Surface Mount: YES

Surface mount design allows for easy installation and integration into electronic circuits, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to incorporate the buffer amplifier into various electronic devices and applications.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with other components or circuits.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance for reliable performance.

Width: 4.4 mm

Compact width of 4.4mm allows for efficient use of space on circuit boards and in electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

This allows for safe and effective reflow soldering process during assembly, ensuring the longevity of the buffer amplifier.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade makes the buffer amplifier suitable for a wide range of operating environments and conditions.

Technical Specifications

Buffer Amplifiers BUF07703PWPG4 attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Operational Characteristics

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Length:

0.256 in (6.5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

20

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Style:

Terminal Finish:

Nickel PalladiumGold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

BUF07703PWPG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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