Loading...

BQ27750DRZT

Texas Instruments

BQ27750DRZT by Texas Instruments

BQ27750DRZT by Texas Instruments is a Power Management IC with 12 terminals, operating temperature range of -40 to 85°C. It features a small outline package style and nickel palladium gold terminal finish. Ideal for industrial applications requiring power supply management circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,001

-

-

-

-

Digiode

USA . 3,816 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,816

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 815 parts In-Stock

1+ parts

$3.500

100+ parts

-

1k+ parts

-

10k+ parts

-

815

$3.500

-

-

-

One Stop Electronics

USA . 1,616 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,616

$4.500

-

-

-

Semicontronic

India . 981 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

-

981

$6.500

$6.338

$6.305

-

Parana Technologies

USA . 424 parts In-Stock

1+ parts

$17.009

100+ parts

$1,579.524

1k+ parts

$15.308

10k+ parts

-

424

$17.009

$1,579.524

$15.308

-

DigiPath Technology Company

USA . 2,313 parts In-Stock

1+ parts

$18.729

100+ parts

-

1k+ parts

-

10k+ parts

-

2,313

$18.729

-

-

-

IDEA Electronic Components Group

UK . 1,472 parts In-Stock

1+ parts

$19.111

100+ parts

$18.155

1k+ parts

$17.200

10k+ parts

-

1,472

$19.111

$18.155

$17.200

-

ChromeModa Solutions

Germany . 1,240 parts In-Stock

1+ parts

$19.111

100+ parts

$15.671

1k+ parts

-

10k+ parts

-

1,240

$19.111

$15.671

-

-

AZTECH Wire

Italy . 797 parts In-Stock

1+ parts

$19.782

100+ parts

-

1k+ parts

-

10k+ parts

-

797

$19.782

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,441

-

-

-

-

Corphita

USA . 4,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,716

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Northwest PG Solutions

USA . 741 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

741

-

-

-

-

Native Components

USA . 615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

615

-

-

-

-

Microchip USA

USA . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

445

-

-

-

-

Corohmni

South Africa . 202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

202

-

-

-

-

Overview

Experience the unparalleled quality and reliability of Texas Instruments with the BQ27750DRZT Power Management IC. Designed for a wide range of applications, this innovative product offers customers exceptional value and benefits. With advanced technology and superior performance, Texas Instruments sets the standard in the industry. Trust in the BQ27750DRZT to provide efficient power supply management and ensure seamless operation in your devices. Choose Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight, cost-effective, and provide good electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

No. of Terminals: 12

Having a higher number of terminals provides flexibility in connections and functionality, allowing for more features and options in the power management circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the power management IC can withstand harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the power management IC to function reliably in extreme cold conditions, expanding its range of applications.

Maximum Seated Height: 1 mm

The low seated height enables the power management IC to be used in slim and compact electronic devices, saving space and improving design flexibility.

Width (mm): 2.5 mm

The small width of the package allows for dense packing of components on the PCB, optimizing space utilization and improving overall system efficiency.

Minimum Supply Voltage (Vsup): 2.2 V

The low minimum supply voltage requirement enables the power management IC to operate efficiently even with low power sources, increasing its versatility in various applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during assembly, preventing solder joint failures and ensuring product longevity.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations, reducing harmful impacts on the environment and human health.

Technical Specifications

Power Management ICs BQ27750DRZT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

BQ27750DRZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20