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BQ27520YZFT-G1

Texas Instruments

BQ27520YZFT-G1 by Texas Instruments

BQ27520YZFT-G1 by Texas Instruments is a Power Management IC with 15 terminals, Vsup range of 2.7V to 4.5V, and operating temperature from -40°C to 85°C. It features adjustable threshold and is ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

$2.252

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$2.130

1k+ parts

$1.900

10k+ parts

$1.790

250

-

$2.130

$1.900

$1.790

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.375

10k+ parts

$2.237

250

-

-

$2.375

$2.237

Distributors (In-Stock)

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Digiode

USA . 3,953 parts In-Stock

1+ parts

$2.242

100+ parts

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3,953

$2.242

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Vyrian

USA . 7,636 parts In-Stock

1+ parts

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7,636

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ComSIT Distribution GmbH

Germany . 250 parts In-Stock

1+ parts

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250

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Prism Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Corphita

USA . 936 parts In-Stock

1+ parts

$2.124

100+ parts

-

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936

$2.124

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Parana Technologies

USA . 1,189 parts In-Stock

1+ parts

$5.789

100+ parts

-

1k+ parts

$6.580

10k+ parts

-

1,189

$5.789

-

$6.580

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DigiPath Technology Company

USA . 2,206 parts In-Stock

1+ parts

$6.374

100+ parts

$5.864

1k+ parts

-

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2,206

$6.374

$5.864

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ChromeModa Solutions

Germany . 6,994 parts In-Stock

1+ parts

$6.504

100+ parts

$5.333

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6,994

$6.504

$5.333

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IDEA Electronic Components Group

UK . 426 parts In-Stock

1+ parts

$6.504

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$5.854

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426

$6.504

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$5.854

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Corohmni

South Africa . 293 parts In-Stock

1+ parts

$17.779

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293

$17.779

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$28.788

100+ parts

$26.197

1k+ parts

$23.606

10k+ parts

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2,000

$28.788

$26.197

$23.606

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A-Z Elektronik GmbH

Germany . 5,514 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Alle Elektronik GmbH

Germany . 3,676 parts In-Stock

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3,676

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Northwest PG Solutions

USA . 1,942 parts In-Stock

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Emar International I/E

Canada . 986 parts In-Stock

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986

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Native Components

USA . 965 parts In-Stock

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965

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Perfect Parts

USA . 735 parts In-Stock

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735

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Kepictronics

USA . 591 parts In-Stock

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Microchip USA

USA . 381 parts In-Stock

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381

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Overview

Unlock the power of superior energy management with the BQ27520YZFT-G1 by Texas Instruments. This top-of-the-line Power Management IC boasts exceptional quality and reliability, making it the go-to choice for a wide range of applications. With a sleek rectangular package shape and surface mount design, this IC offers unmatched performance in a compact form factor. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Experience the difference with the BQ27520YZFT-G1 and optimize your power management needs effortlessly.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly process.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal supply voltage for efficient and reliable operation of the power management IC.

No. of Terminals: 15

Sufficient number of terminals for connecting various components in the circuit, providing flexibility in design.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without compromising performance, suitable for industrial applications.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the connections.

Width (mm): 1.956 mm

Compact width making it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7 V

Wide operating voltage range allows flexibility in power supply options.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during manufacturing process.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments with varying temperatures.

Terminal Pitch: 0.5 mm

Fine pitch terminals enable high-density mounting on PCBs, saving board space.

Maximum Supply Voltage (Vsup): 4.5 V

Supports higher supply voltages for powering various components efficiently.

Adjustable Threshold: YES

Allows customization of threshold levels, providing flexibility in power management control.

Technical Specifications

Power Management ICs BQ27520YZFT-G1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B15

JESD-609 Code:

e1

Length:

2.61 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA15,3X5,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.956 mm

Trade Compliance

BQ27520YZFT-G1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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