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BQ27410DRZT-G1

Texas Instruments

BQ27410DRZT-G1 by Texas Instruments

BQ27410DRZT-G1 by Texas Instruments is a Power Management IC with 12 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.4V to 2.6V and is suitable for industrial applications requiring small outline package style and surface mount compatibility.

Median Price

$5.400

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15 parts In-Stock

1+ parts

-

100+ parts

$5.400

1k+ parts

$4.830

10k+ parts

$4.540

15

-

$5.400

$4.830

$4.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,051 parts In-Stock

1+ parts

$5.700

100+ parts

-

1k+ parts

-

10k+ parts

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4,051

$5.700

-

-

-

Chip Stock

USA . 11,000 parts In-Stock

1+ parts

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11,000

-

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Vyrian

USA . 7,053 parts In-Stock

1+ parts

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7,053

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-

-

-

ACDS - Activité Composants Distribution Service

France . 500 parts In-Stock

1+ parts

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1k+ parts

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500

-

-

-

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Bristol Electronics

USA . 500 parts In-Stock

1+ parts

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500

-

-

-

-

Dan-Mar Components

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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500

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Prism Electronics

USA . 250 parts In-Stock

1+ parts

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250

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,370 parts In-Stock

1+ parts

$5.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,370

$5.400

-

-

-

Parana Technologies

USA . 451 parts In-Stock

1+ parts

$5.950

100+ parts

-

1k+ parts

$6.730

10k+ parts

-

451

$5.950

-

$6.730

-

ChromeModa Solutions

Germany . 3,017 parts In-Stock

1+ parts

$6.685

100+ parts

$5.482

1k+ parts

-

10k+ parts

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3,017

$6.685

$5.482

-

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IDEA Electronic Components Group

UK . 625 parts In-Stock

1+ parts

$6.685

100+ parts

-

1k+ parts

$6.016

10k+ parts

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625

$6.685

-

$6.016

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AZTECH Wire

Italy . 300 parts In-Stock

1+ parts

$9.790

100+ parts

-

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300

$9.790

-

-

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Andel Nordic

Denmark . 2,144 parts In-Stock

1+ parts

$10.585

100+ parts

-

1k+ parts

$10.162

10k+ parts

$10.162

2,144

$10.585

-

$10.162

$10.162

Native Components

USA . 730 parts In-Stock

1+ parts

$264.000

100+ parts

$258.720

1k+ parts

$256.080

10k+ parts

$253.440

730

$264.000

$258.720

$256.080

$253.440

Northwest PG Solutions

USA . 233 parts In-Stock

1+ parts

$290.400

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233

$290.400

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A-Z Elektronik GmbH

Germany . 5,474 parts In-Stock

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5,474

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Lixinc

USA . 5,103 parts In-Stock

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Perfect Parts

USA . 3,886 parts In-Stock

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3,886

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Alle Elektronik GmbH

Germany . 3,649 parts In-Stock

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3,649

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DigiPath Technology Company

USA . 2,147 parts In-Stock

1+ parts

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$6.027

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2,147

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$6.027

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Kepictronics

USA . 600 parts In-Stock

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600

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Cyclops Electronics Ltd (Excess)

UK . 456 parts In-Stock

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456

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Authorized Procurement Solutions

USA . 250 parts In-Stock

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250

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Microchip USA

USA . 191 parts In-Stock

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191

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Glotronic Ltd.

UK . 170 parts In-Stock

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170

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Overview

Elevate your power management capabilities with the BQ27410DRZT-G1 from Texas Instruments. Manufactured with top-notch quality and precision, this Power Management IC is designed to meet the highest industry standards. Ideal for a wide range of applications, this product offers unmatched value, benefits, and advantages to customers looking for reliable and efficient power supply management solutions. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for various environments and applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly processes.

Nominal Supply Voltage (Vsup): 2.5 V

Provides a stable supply voltage for consistent performance of the power management IC.

No. of Terminals: 12

Sufficient number of terminals for connecting to other components and circuitry, enabling versatile usage.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications where heat dissipation is a concern.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides good conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Width (mm): 2.5 mm

Compact width allows for space-saving designs and integration into smaller electronic devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power supply management, ensuring efficient power delivery and protection for connected devices.

Temperature Grade: INDUSTRIAL

Built to withstand harsh industrial environments, ensuring reliability in demanding conditions.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level allows for safe storage and handling, reducing the risk of damage during assembly.

Technical Specifications

Power Management ICs BQ27410DRZT-G1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

2.6 V

Minimum Supply Voltage (Vsup):

2.4 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

BQ27410DRZT-G1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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