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BQ26501PWG4

Texas Instruments

BQ26501PWG4 by Texas Instruments

BQ26501PWG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.6V to 4.5V, and temperature range from -20°C to 70°C. It is designed for power supply support circuits in applications requiring a small outline package with dual terminal position and gull wing form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,398 parts In-Stock

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6,398

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Digiode

USA . 661 parts In-Stock

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661

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Euro-Tech

UK . 296 parts In-Stock

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296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 101 parts In-Stock

1+ parts

$0.180

100+ parts

-

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-

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$0.173

101

$0.180

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$0.173

Northwest PG Solutions

USA . 2,192 parts In-Stock

1+ parts

$0.198

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-

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$0.174

2,192

$0.198

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$0.174

Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$4.939

100+ parts

$4.494

1k+ parts

$4.050

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-

20

$4.939

$4.494

$4.050

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One Stop Electronics

USA . 587 parts In-Stock

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$6.500

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587

$6.500

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Parana Technologies

USA . 2,183 parts In-Stock

1+ parts

$9.961

100+ parts

$925.019

1k+ parts

$8.965

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-

2,183

$9.961

$925.019

$8.965

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DigiPath Technology Company

USA . 329 parts In-Stock

1+ parts

$10.968

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329

$10.968

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ChromeModa Solutions

Germany . 2,623 parts In-Stock

1+ parts

$11.192

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$9.177

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2,623

$11.192

$9.177

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IDEA Electronic Components Group

UK . 310 parts In-Stock

1+ parts

$11.192

100+ parts

$10.632

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$10.073

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310

$11.192

$10.632

$10.073

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Corohmni

South Africa . 31 parts In-Stock

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$17.587

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31

$17.587

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AZTECH Wire

Italy . 875 parts In-Stock

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$18.265

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875

$18.265

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Corphita

USA . 3,171 parts In-Stock

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Microchip USA

USA . 1,610 parts In-Stock

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1,610

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Overview

Enhance your power management solutions with the BQ26501PWG4 from Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers a wide range of Power Management ICs designed to optimize performance and efficiency. This small outline, thin profile IC is perfect for various applications that require precise power supply support. With a nominal supply voltage of 3V, dual terminal position, and nickel palladium gold finish, this IC provides unmatched value and benefits to customers seeking top-notch power management solutions. Trust Texas Instruments to deliver excellence in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and allows for efficient heat dissipation, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on circuit boards, saving space and enabling streamlined manufacturing processes.

Nominal Supply Voltage (Vsup): 3 V

Optimal supply voltage ensures stable performance and efficiency, reducing the risk of damage or malfunction.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions, making it suitable for a wide range of applications.

Width (mm): 3 mm

Compact width allows for integration into small electronic devices and tight spaces, enhancing versatility and flexibility in design.

Minimum Supply Voltage (Vsup): 2.6 V

Low minimum supply voltage requirement ensures compatibility with a range of power sources, offering flexibility in system design and compatibility.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables reliable soldering during manufacturing processes, ensuring secure and durable connections.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates that the product has a moderate level of sensitivity to moisture, making it suitable for various environmental conditions while providing adequate protection.

Maximum Supply Voltage (Vsup): 4.5 V

High maximum supply voltage tolerance allows for flexibility in power input options, accommodating a wide range of voltage sources for diverse applications.

Technical Specifications

Power Management ICs BQ26501PWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ26501PWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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