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BQ26100DRP

Texas Instruments

BQ26100DRP by Texas Instruments

BQ26100DRP by Texas Instruments is a Power Management IC with 6 terminals, operating b/w -40 to 85°C. It supports supply voltages from 2.5V to 5V and comes in a small outline package suitable for industrial applications. The IC features nickel palladium gold terminal finish and is designed for power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,675 parts In-Stock

1+ parts

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7,675

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Digiode

USA . 4,126 parts In-Stock

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4,126

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,486 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,486

$1.500

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Ampacity Inc.

Singapore . 878 parts In-Stock

1+ parts

$2.500

100+ parts

-

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878

$2.500

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Semicontronic

India . 786 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

786

$4.500

$4.388

$4.365

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Native Components

USA . 962 parts In-Stock

1+ parts

$5.420

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-

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962

$5.420

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AZTECH Wire

Italy . 750 parts In-Stock

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$16.448

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750

$16.448

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Parana Technologies

USA . 2,005 parts In-Stock

1+ parts

$16.879

100+ parts

-

1k+ parts

$17.118

10k+ parts

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2,005

$16.879

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$17.118

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ChromeModa Solutions

Germany . 6,244 parts In-Stock

1+ parts

$18.965

100+ parts

$15.551

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6,244

$18.965

$15.551

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IDEA Electronic Components Group

UK . 268 parts In-Stock

1+ parts

$18.965

100+ parts

$18.017

1k+ parts

$17.068

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268

$18.965

$18.017

$17.068

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Corphita

USA . 2,461 parts In-Stock

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2,461

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DigiPath Technology Company

USA . 1,974 parts In-Stock

1+ parts

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$17.099

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1,974

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$17.099

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Northwest PG Solutions

USA . 587 parts In-Stock

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$5.312

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587

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$5.312

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Corohmni

South Africa . 72 parts In-Stock

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72

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Overview

Unlock the power of efficient and reliable power management with the BQ26100DRP by Texas Instruments. As a trusted industry leader, Texas Instruments delivers top-quality Power Management ICs that are perfect for a wide range of applications. With a small outline, heat sink profile, and dual terminals, this IC offers superior performance and durability. From industrial to consumer electronics, this product provides seamless power supply support. Experience the value and benefits of Texas Instruments with the BQ26100DRP - the ultimate solution for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic devices, ensuring compatibility.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting various components and peripherals.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand heat and operate reliably in industrial environments.

Minimum Operating Temperature: -40 °C

The ability to function in temperatures as low as -40°C makes this product suitable for a wide range of applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC can efficiently manage and regulate power, ensuring stability and performance.

Width (mm): 3 mm

The compact width of 3mm saves space on the PCB and allows for more efficient layout design.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum supply voltage of 2.5V allows for operation with lower power sources, increasing versatility.

Terminal Pitch: 0.95 mm

The small terminal pitch of 0.95mm enables high-density mounting on the PCB, optimizing space usage.

Technical Specifications

Power Management ICs BQ26100DRP attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

BQ26100DRP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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