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BQ26200PWRG4

Texas Instruments

BQ26200PWRG4 by Texas Instruments

BQ26200PWRG4 by Texas Instruments is a Power Management IC with 3/5 V power supplies, 8 terminals, and 3.6 V nominal voltage. It is used in power supply support circuits for commercial applications due to its small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,977 parts In-Stock

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2,977

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Vyrian

USA . 2,807 parts In-Stock

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2,807

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 580 parts In-Stock

1+ parts

$0.500

100+ parts

-

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580

$0.500

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Semicontronic

India . 810 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

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-

810

$6.500

$6.338

$6.305

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Native Components

USA . 426 parts In-Stock

1+ parts

$9.300

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426

$9.300

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Northwest PG Solutions

USA . 1,473 parts In-Stock

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$10.230

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$9.207

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1,473

$10.230

$9.207

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Parana Technologies

USA . 195 parts In-Stock

1+ parts

$12.173

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$12.585

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195

$12.173

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$12.585

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DigiPath Technology Company

USA . 490 parts In-Stock

1+ parts

$13.403

100+ parts

$12.331

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490

$13.403

$12.331

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ChromeModa Solutions

Germany . 5,298 parts In-Stock

1+ parts

$13.677

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$11.215

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5,298

$13.677

$11.215

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IDEA Electronic Components Group

UK . 502 parts In-Stock

1+ parts

$13.677

100+ parts

$12.993

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$12.309

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502

$13.677

$12.993

$12.309

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AZTECH Wire

Italy . 441 parts In-Stock

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$19.772

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441

$19.772

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Component Stockers USA

USA . 746 parts In-Stock

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$99.990

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746

$99.990

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Corphita

USA . 2,960 parts In-Stock

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Microchip USA

USA . 2,534 parts In-Stock

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Corohmni

South Africa . 443 parts In-Stock

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443

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Overview

Elevate your power management game with the BQ26200PWRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Power Management ICs like no other. Perfect for a wide range of applications, this product offers exceptional value and benefits to customers looking for reliable and efficient power supply support circuits. Experience the advantages of Texas Instruments technology with the BQ26200PWRG4 - your solution for superior power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration into PCB designs, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6 V supply voltage ensures compatibility with a wide range of systems and applications.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing with other components in the circuit.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance under varying environmental conditions.

Maximum Time At Peak Reflow Temperature (s): 30

With a peak reflow temperature duration of 30 seconds, the IC can be efficiently soldered onto the PCB during assembly.

Width (mm): 3 mm

The compact width of 3 mm makes the IC suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 2.8 V

The 2.8 V minimum supply voltage ensures stable operation even under low power conditions.

Maximum Supply Current (Isup): 0.12 mA

The low maximum supply current of 0.12 mA helps in minimizing power consumption and heat dissipation.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that the IC is suitable for reflow soldering and has a moderate sensitivity to moisture exposure.

Technical Specifications

Power Management ICs BQ26200PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.12 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ26200PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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