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BQ26220PWG4

Texas Instruments

BQ26220PWG4 by Texas Instruments

BQ26220PWG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.8-4.5V, and compact rectangular package style. Ideal for power supply support circuits in applications requiring a nominal voltage of 3.6V, it features a small outline design with dual terminal position and nickel palladium gold finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,479 parts In-Stock

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8,479

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Digiode

USA . 1,639 parts In-Stock

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1,639

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Distributors (Availability)

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Ampacity Inc.

Singapore . 568 parts In-Stock

1+ parts

$4.500

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568

$4.500

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Semicontronic

India . 946 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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946

$5.500

$5.362

$5.335

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One Stop Electronics

USA . 282 parts In-Stock

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$5.500

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282

$5.500

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Corohmni

South Africa . 267 parts In-Stock

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$16.250

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267

$16.250

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$17.963

100+ parts

$16.346

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$14.730

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1,000

$17.963

$16.346

$14.730

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AZTECH Wire

Italy . 352 parts In-Stock

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$19.578

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352

$19.578

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Parana Technologies

USA . 1,912 parts In-Stock

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$20.187

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$20.148

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1,912

$20.187

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$20.148

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DigiPath Technology Company

USA . 2,211 parts In-Stock

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$22.228

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$20.450

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2,211

$22.228

$20.450

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ChromeModa Solutions

Germany . 4,240 parts In-Stock

1+ parts

$22.682

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$18.599

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4,240

$22.682

$18.599

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IDEA Electronic Components Group

UK . 691 parts In-Stock

1+ parts

$22.682

100+ parts

$21.548

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$20.414

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691

$22.682

$21.548

$20.414

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Component Stockers USA

USA . 255 parts In-Stock

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$99.990

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255

$99.990

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Corphita

USA . 4,429 parts In-Stock

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Northwest PG Solutions

USA . 2,257 parts In-Stock

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Microchip USA

USA . 1,265 parts In-Stock

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Native Components

USA . 597 parts In-Stock

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597

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Perfect Parts

USA . 112 parts In-Stock

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112

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Overview

Unlock the power of efficient and reliable power management with the BQ26220PWG4 by Texas Instruments. As a renowned manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. The BQ26220PWG4 falls under the category of Power Management ICs, offering customers a compact and versatile solution for their power supply support circuits. With its small outline, thin profile package and superior terminal finish, this IC provides unmatched performance in a wide range of applications. Trust in Texas Instruments to bring you the value and benefits you need for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and reliability to the product, ensuring a long lifespan.

Surface Mount: YES

Enables easy and efficient mounting on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal supply voltage for efficient power management and performance.

Power Supplies (V): 2.8/4.5

Versatile power supply options allow flexibility in different applications and scenarios.

Maximum Operating Temperature: 70 °C

Ability to function reliably in high temperature environments, ensuring consistent performance.

Minimum Operating Temperature: -20 °C

Suitable for operation in cold temperatures without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, enhancing the product's reliability.

Width (mm): 3 mm

Compact size allows for efficient use of space on the circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, ensuring optimal power management.

Terminal Pitch: 0.65 mm

Fine pitch spacing enables high-density mounting, suitable for compact designs.

Technical Specifications

Power Management ICs BQ26220PWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.8/4.5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.037 mA

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ26220PWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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