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BQ26150DDCR

Texas Instruments

BQ26150DDCR by Texas Instruments

BQ26150DDCR by Texas Instruments is a Power Management IC with 5 terminals, suitable for power supply support circuits. It has a small outline package style, dual terminal position, and operates b/w -20°C to 70°C. Ideal for applications requiring compact design and efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,860 parts In-Stock

1+ parts

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7,860

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Digiode

USA . 808 parts In-Stock

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808

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 687 parts In-Stock

1+ parts

$0.159

100+ parts

-

1k+ parts

-

10k+ parts

$0.153

687

$0.159

-

-

$0.153

Northwest PG Solutions

USA . 1,113 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

$0.154

1,113

$0.175

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-

$0.154

Semicontronic

India . 346 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

346

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 303 parts In-Stock

1+ parts

$3.500

100+ parts

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303

$3.500

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Ampacity Inc.

Singapore . 1,092 parts In-Stock

1+ parts

$6.500

100+ parts

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1,092

$6.500

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AZTECH Wire

Italy . 856 parts In-Stock

1+ parts

$9.766

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856

$9.766

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Parana Technologies

USA . 1,264 parts In-Stock

1+ parts

$13.420

100+ parts

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$13.937

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1,264

$13.420

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$13.937

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DigiPath Technology Company

USA . 560 parts In-Stock

1+ parts

$14.777

100+ parts

$13.595

1k+ parts

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560

$14.777

$13.595

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ChromeModa Solutions

Germany . 1,701 parts In-Stock

1+ parts

$15.079

100+ parts

$12.365

1k+ parts

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1,701

$15.079

$12.365

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IDEA Electronic Components Group

UK . 1,035 parts In-Stock

1+ parts

$15.079

100+ parts

$14.325

1k+ parts

$13.571

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1,035

$15.079

$14.325

$13.571

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Corphita

USA . 4,786 parts In-Stock

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4,786

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Corohmni

South Africa . 192 parts In-Stock

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192

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Overview

Discover the power of innovation with the BQ26150DDCR by Texas Instruments, a leader in Power Management ICs. This small but mighty device offers unparalleled quality and reliability, making it ideal for a wide range of applications. From power supply support circuits to battery management systems, this product delivers exceptional performance in a compact package. Trust Texas Instruments to provide you with cutting-edge technology that seamlessly integrates into your projects, offering value and peace of mind. Elevate your designs with the BQ26150DDCR and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability during operation, making this product a good choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly process.

Package Shape: RECTANGULAR

The rectangular shape provides a compact design, making it ideal for applications where space is limited.

No. of Terminals: 5

Having a sufficient number of terminals allows for versatile connectivity options, enabling compatibility with various systems.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design enhances the overall compactness of the product, making it suitable for small form factor applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments, ensuring reliable performance under demanding conditions.

Minimum Operating Temperature: -20 °C

The ability to operate at temperatures as low as -20°C makes this product suitable for use in a wide range of environments, including cold conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connection, allowing for easy integration into different systems.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm enables the product to be used in compact designs without compromising on performance.

Width (mm): 1.6 mm

The narrow width of 1.6 mm allows for easy placement in tight spaces, making it a versatile and space-saving solution.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This product's power supply support circuit ensures stable and efficient power delivery, making it an excellent choice for applications requiring reliable power management.

Length: 2.9 mm

The compact length of 2.9 mm contributes to the overall small form factor design, making it ideal for use in portable and space-constrained devices.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this product meets industry standards for performance and reliability, making it a trusted choice for various commercial projects.

Terminal Form: GULL WING

The gull wing terminal form provides secure connection and easy soldering, ensuring a reliable and efficient electrical connection.

Terminal Pitch: 0.95 mm

With a small terminal pitch of 0.95 mm, this product offers high density interconnection, allowing for compact and efficient PCB layouts.

Technical Specifications

Power Management ICs BQ26150DDCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.6 mm

Trade Compliance

BQ26150DDCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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