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BQ26221PW

Texas Instruments

BQ26221PW by Texas Instruments

BQ26221PW by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.8V to 4.5V, and compact dimensions of 4.4mm x 3mm. It features a small outline package suitable for power supply support circuits in applications requiring temperatures from -20°C to 70°C. The device is surface mountable with nickel palladium gold finish and dual terminal position for efficient PCB integration.

Median Price

$11.000

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,362 parts In-Stock

1+ parts

$11.109

100+ parts

$9.703

1k+ parts

$6.692

10k+ parts

-

6,362

$11.109

$9.703

$6.692

-

Mouser Electronics

USA . 77 parts In-Stock

1+ parts

$14.610

100+ parts

$10.700

1k+ parts

$10.110

10k+ parts

-

77

$14.610

$10.700

$10.110

-

Rochester

USA . 218 parts In-Stock

1+ parts

-

100+ parts

$8.360

1k+ parts

$7.480

10k+ parts

$7.040

218

-

$8.360

$7.480

$7.040

DigiKey

USA . 218 parts In-Stock

1+ parts

-

100+ parts

$11.000

1k+ parts

-

10k+ parts

-

218

-

$11.000

-

-

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$10.450

1k+ parts

$9.350

10k+ parts

$8.800

200

-

$10.450

$9.350

$8.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$8.729

100+ parts

-

1k+ parts

-

10k+ parts

-

68

$8.729

-

-

-

Digiode

USA . 1,644 parts In-Stock

1+ parts

$8.826

100+ parts

-

1k+ parts

-

10k+ parts

-

1,644

$8.826

-

-

-

Vyrian

USA . 5,378 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,378

-

-

-

-

VNN

France . 3,303 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,303

-

-

-

-

DigiKey Marketplace

USA . 218 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

218

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,268 parts In-Stock

1+ parts

$2.426

100+ parts

-

1k+ parts

$2.924

10k+ parts

-

2,268

$2.426

-

$2.924

-

DigiPath Technology Company

USA . 2,312 parts In-Stock

1+ parts

$2.671

100+ parts

$2.458

1k+ parts

-

10k+ parts

-

2,312

$2.671

$2.458

-

-

ChromeModa Solutions

Germany . 4,006 parts In-Stock

1+ parts

$2.726

100+ parts

$2.235

1k+ parts

-

10k+ parts

-

4,006

$2.726

$2.235

-

-

IDEA Electronic Components Group

UK . 796 parts In-Stock

1+ parts

$2.726

100+ parts

-

1k+ parts

$2.453

10k+ parts

-

796

$2.726

-

$2.453

-

Ampacity Inc.

Singapore . 1,583 parts In-Stock

1+ parts

$7.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,583

$7.900

-

-

-

Corphita

USA . 1,191 parts In-Stock

1+ parts

$8.361

100+ parts

-

1k+ parts

-

10k+ parts

-

1,191

$8.361

-

-

-

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$8.729

100+ parts

$8.293

1k+ parts

-

10k+ parts

$7.769

1,000

$8.729

$8.293

-

$7.769

Perfect Parts

USA . 142 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

142

-

-

-

-

Overview

Discover the BQ26221PW by Texas Instruments, a cutting-edge Power Management IC that offers unparalleled quality and reliability. Designed with precision by a trusted manufacturer, this innovative IC is perfect for a wide range of applications in the electronics industry. With its advanced features and compact design, the BQ26221PW provides exceptional value and performance, making it the ideal choice for customers looking for top-notch power management solutions. Trust Texas Instruments to deliver excellence with every product they create.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the IC, making it a reliable choice for power management applications.

Surface Mount:

YES - The surface mount feature allows for easy and efficient installation, saving time and effort during assembly.

Package Shape:

RECTANGULAR - The rectangular shape of the package makes it easy to integrate into circuit designs and saves space on the PCB.

Nominal Supply Voltage (Vsup):

3.6 V - The optimal supply voltage ensures stable and efficient power management for various electronic devices.

No. of Terminals:

8 - With a sufficient number of terminals, this IC can handle multiple connections and effectively distribute power.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - This package style offers a compact design for space-constrained applications, making it a versatile choice for power management.

Maximum Operating Temperature:

70 °C - The high maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature:

20 °C - The low minimum operating temperature allows for operation in a wide range of temperature conditions, making it suitable for diverse applications.

Terminal Finish:

NICKEL PALLADIUM GOLD - The terminal finish provides excellent conductivity and corrosion resistance for reliable power transmission.

Terminal Position:

DUAL - The dual terminal position offers versatile installation options to accommodate different circuit layouts.

Maximum Seated Height:

1.2 mm - The low seated height enables a compact overall design for space-saving power management solutions.

Width (mm):

3 mm - The narrow width of the IC allows for efficient placement on the PCB, optimizing space usage.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT - This IC type is specifically designed to support power supply functions, ensuring efficient and stable power management.

Minimum Supply Voltage (Vsup):

2.8 V - The minimum supply voltage ensures compatibility with a wide range of power sources, making it a versatile choice for different applications.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature allows for reliable soldering during the assembly process.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures secure solder joints for robust and durable connections.

Length:

4.4 mm - The compact length of the IC facilitates easy integration into circuit designs while saving space on the PCB.

Terminal Form:

GULL WING - The gull wing terminal form enables secure soldering and reliable electrical connections for efficient power distribution.

Terminal Pitch:

0.65 mm - The small terminal pitch allows for precise placement on the PCB, optimizing space usage and ensuring efficient power management.

Moisture Sensitivity Level (MSL):

2 - The MSL rating indicates the IC's tolerance to moisture exposure, ensuring reliability in various environmental conditions.

Maximum Supply Voltage (Vsup):

4.5 V - The maximum supply voltage provides flexibility for use with different power sources, making it a versatile choice for power management applications.

Technical Specifications

Power Management ICs BQ26221PW attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ26221PW Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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