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BQ26500PWR

Texas Instruments

BQ26500PWR by Texas Instruments

BQ26500PWR by Texas Instruments is a Power Management IC with 8 terminals and a supply voltage range of 2.6V to 4.5V. It features a small outline package, dual terminal position, and operates b/w 0°C to 70°C. Ideal for power supply support circuits in commercial-grade applications requiring compact design and surface-mount capability.

Median Price

$10.675

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23,090 parts In-Stock

1+ parts

$10.675

100+ parts

$9.325

1k+ parts

$6.431

10k+ parts

-

23,090

$10.675

$9.325

$6.431

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,453 parts In-Stock

1+ parts

$10.141

100+ parts

-

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-

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3,453

$10.141

-

-

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Vyrian

USA . 5,354 parts In-Stock

1+ parts

-

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5,354

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Bristol Electronics

USA . 205 parts In-Stock

1+ parts

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205

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Cyclops Electronics Ltd

UK . 170 parts In-Stock

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170

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Prism Electronics

USA . 161 parts In-Stock

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161

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 178 parts In-Stock

1+ parts

$1.283

100+ parts

-

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-

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178

$1.283

-

-

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Northwest PG Solutions

USA . 324 parts In-Stock

1+ parts

$1.411

100+ parts

-

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324

$1.411

-

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Parana Technologies

USA . 778 parts In-Stock

1+ parts

$8.451

100+ parts

-

1k+ parts

$9.095

10k+ parts

-

778

$8.451

-

$9.095

-

DigiPath Technology Company

USA . 1,785 parts In-Stock

1+ parts

$9.306

100+ parts

$8.562

1k+ parts

-

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1,785

$9.306

$8.562

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ChromeModa Solutions

Germany . 2,947 parts In-Stock

1+ parts

$9.496

100+ parts

$7.787

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-

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2,947

$9.496

$7.787

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IDEA Electronic Components Group

UK . 1,459 parts In-Stock

1+ parts

$9.496

100+ parts

$9.021

1k+ parts

$8.546

10k+ parts

-

1,459

$9.496

$9.021

$8.546

-

Corphita

USA . 1,833 parts In-Stock

1+ parts

$9.608

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1,833

$9.608

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AZTECH Wire

Italy . 985 parts In-Stock

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$12.000

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985

$12.000

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Lixinc

USA . 12,869 parts In-Stock

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12,869

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A-Z Elektronik GmbH

Germany . 6,462 parts In-Stock

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6,462

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Alle Elektronik GmbH

Germany . 4,308 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Cyclops Electronics Ltd (Excess)

UK . 454 parts In-Stock

1+ parts

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454

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GreenTree Electronics

Israel . 207 parts In-Stock

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207

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Overview

Enhance the power management of your devices with the high-quality BQ26500PWR by Texas Instruments. Designed with precision and expertise, this power management IC offers unparalleled reliability and efficiency. Ideal for a wide range of applications, this small outline, thin profile IC provides seamless power supply support circuitry. With a nominal supply voltage of 3V and a compact design, customers can trust in the exceptional performance and value that this product delivers. Upgrade your devices today with the BQ26500PWR and experience the difference Texas Instruments brings to power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable makes it easy to integrate this Power Management IC into a system or PCB, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 3 V

The 3V nominal supply voltage is a commonly used voltage level in many electronic devices, making this Power Management IC compatible with a wide range of applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this Power Management IC can withstand high temperature environments without compromising performance or reliability.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C ensures that this Power Management IC can function effectively in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable electrical connection for optimal performance.

Width (mm): 3 mm

The compact width of 3mm makes this Power Management IC suitable for applications where space is limited, allowing for more efficient design layouts.

Minimum Supply Voltage (Vsup): 2.6 V

With a minimum supply voltage of 2.6V, this Power Management IC can operate efficiently even at lower voltage levels, making it versatile for different power supply requirements.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a peak reflow temperature for up to 30 seconds during assembly ensures reliable soldering and prevents damage to the Power Management IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for a robust soldering process, resulting in secure attachment of the Power Management IC to the PCB.

Technical Specifications

Power Management ICs BQ26500PWR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.6 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ26500PWR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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