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ADC3682IRSBT

Texas Instruments

ADC3682IRSBT by Texas Instruments

ADC3682IRSBT by Texas Instruments is an 18-bit ADC with 2 analog in channels, 25 MHz sample rate, and 0.0061035% max linearity error. It is used in applications requiring high precision data conversion like industrial automation and medical equipment due to its low operating temperature range of -40 to 105 °C.

Median Price

$86.450

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,132 parts In-Stock

1+ parts

$86.450

100+ parts

$83.850

1k+ parts

$65.000

10k+ parts

-

1,132

$86.450

$83.850

$65.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,573 parts In-Stock

1+ parts

$82.128

100+ parts

-

1k+ parts

-

10k+ parts

-

3,573

$82.128

-

-

-

Vyrian

USA . 5,956 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,956

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 663 parts In-Stock

1+ parts

$0.040

100+ parts

-

1k+ parts

-

10k+ parts

$0.038

663

$0.040

-

-

$0.038

Semicontronic

India . 22 parts In-Stock

1+ parts

$70.610

100+ parts

$68.845

1k+ parts

$68.492

10k+ parts

-

22

$70.610

$68.845

$68.492

-

Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$70.610

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$70.610

-

-

-

Corphita

USA . 3,516 parts In-Stock

1+ parts

$77.805

100+ parts

-

1k+ parts

-

10k+ parts

-

3,516

$77.805

-

-

-

Corohmni

South Africa . 250 parts In-Stock

1+ parts

$83.070

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$83.070

-

-

-

Microchip USA

USA . 1,625 parts In-Stock

1+ parts

$137.410

100+ parts

$135.020

1k+ parts

$133.820

10k+ parts

$132.630

1,625

$137.410

$135.020

$133.820

$132.630

Northwest PG Solutions

USA . 1,798 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,798

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Overview

Discover the ADC3682IRSBT by Texas Instruments, a cutting-edge Analog-to-Digital Converter designed to deliver unparalleled precision and reliability. Manufactured by industry leader Texas Instruments, this product boasts a high level of quality and performance. Ideal for a wide range of applications, this ADC offers customers exceptional value and benefits, including accurate data conversion, compact size, and ease of installation. Upgrade your project with the ADC3682IRSBT and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product lightweight and cost-effective.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in interfacing with multiple signals.

Surface Mount: YES

The surface mount capability makes installation and integration easier in various electronic systems.

No. of Bits: 18

With 18 bits resolution, this ADC provides high precision in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0061035%

The low linearity error ensures accurate conversion and reliable performance.

No. of Terminals: 40

The 40 terminals offer sufficient connectivity options for different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink design help in efficient heat dissipation and space-saving installation.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows for operation in various environments.

Minimum Operating Temperature: -40 °C

The wide temperature range enables the product to function in extreme cold conditions as well.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold finish ensures reliable and long-lasting terminal connections.

Terminal Position: QUAD

The quad terminal position offers stability and secure connections in the system layout.

Width: 5 mm

The compact width size enables easy integration into space-constrained electronic designs.

Length: 5 mm

The small length size contributes to a compact and efficient product design.

Sample Rate: 25 MHz

The high sample rate allows for rapid analog-to-digital conversion and real-time data processing.

Maximum Analog Input Voltage: 3.2 V

The high maximum analog input voltage range accommodates a wide range of signal levels.

Nominal Supply Voltage: 1.8 V

The lower nominal supply voltage enhances power efficiency and reduces energy consumption.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Offering both offset binary and 2's complement binary output formats provides flexibility in data representation.

Output Format: SERIAL

The serial output format enables easy interfacing with other digital systems and devices.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the product's resistance to moisture and reliability in humid conditions.

Technical Specifications

Analog-to-Digital Converters ADC3682IRSBT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

18

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061035 %

Sample Rate:

25 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

46 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3682IRSBT Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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