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ADC3681IRSBR

Texas Instruments

ADC3681IRSBR by Texas Instruments

Texas Instruments ADC3681IRSBR is an 18-bit ADC with 2 analog in channels, operating at a max temp of 105°C. It features a sample rate of 10 MHz and output format is serial. Ideal for applications requiring high precision analog-to-digital conversion in compact spaces.

Median Price

$74.970

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,168 parts In-Stock

1+ parts

$74.970

100+ parts

$66.640

1k+ parts

$49.000

10k+ parts

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11,168

$74.970

$66.640

$49.000

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Distributors (In-Stock)

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Digiode

USA . 631 parts In-Stock

1+ parts

$71.222

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631

$71.222

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Vyrian

USA . 6,815 parts In-Stock

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6,815

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AZTECH Wire

Italy . 101 parts In-Stock

1+ parts

$12.630

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101

$12.630

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Semicontronic

India . 10,982 parts In-Stock

1+ parts

$63.720

100+ parts

$62.127

1k+ parts

$61.808

10k+ parts

-

10,982

$63.720

$62.127

$61.808

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Ampacity Inc.

Singapore . 10,858 parts In-Stock

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$63.720

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10,858

$63.720

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Corphita

USA . 3,809 parts In-Stock

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$67.473

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3,809

$67.473

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Corohmni

South Africa . 158 parts In-Stock

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$74.970

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158

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Northwest PG Solutions

USA . 355 parts In-Stock

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355

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Native Components

USA . 312 parts In-Stock

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Overview

Discover the ADC3681IRSBR by Texas Instruments, a high-quality Analog-to-Digital Converter that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is sure to exceed your expectations. Ideal for a wide range of applications, this converter boasts 18 bits of precision, ensuring accurate data conversion. From its compact chip carrier package to its impressive sample rate of 10 MHz, the ADC3681IRSBR delivers value, benefits, and advantages that will enhance your projects. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for simultaneous conversion of multiple analog signals, increasing efficiency.

Surface Mount: YES

Being surface mount compatible makes installation and PCB design easier and more convenient.

No. of Bits: 18

With 18 bits, this ADC offers high resolution and accuracy in converting analog signals to digital, making it suitable for precision measurements.

Maximum Linearity Error (EL): 0.0061035%

The low linearity error ensures the accuracy and consistency of the converted digital output, important for precise data acquisition.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier package style with a heat sink/slug and very thin profile helps in efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows the ADC to perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the ADC suitable for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides good conductivity and resistance to corrosion, ensuring long-term reliability.

Maximum Analog Input Voltage: 3.2 V

Supporting a maximum analog input voltage of 3.2V, the ADC can handle a wide range of input signals.

Sample Rate: 10 MHz

With a high sample rate of 10 MHz, the ADC can quickly capture and process analog signals, suitable for fast data acquisition applications.

Maximum Supply Current: 46 mA

The low maximum supply current consumption helps in reducing power usage and extending battery life in portable devices.

Nominal Supply Voltage: 1.8 V

Operating at a low nominal supply voltage of 1.8V, the ADC is energy efficient and suitable for battery-powered applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Supporting multiple output bit codes gives flexibility in interfacing with different systems and devices.

Output Format: SERIAL

The serial output format simplifies data transmission and integration with other digital systems.

Moisture Sensitivity Level (MSL): 3

Having MSL level 3 indicates that the ADC is moderately sensitive to moisture, suitable for standard manufacturing and handling processes.

Technical Specifications

Analog-to-Digital Converters ADC3681IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

18

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061035 %

Sample Rate:

10 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

46 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3681IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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