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ADC3644IRSBR

Texas Instruments

ADC3644IRSBR by Texas Instruments

Texas Instruments ADC3644IRSBR is a 14-bit ADC with 2 analog in channels, operating from -40 to 105°C. It features a sample rate of 125 MHz and max supply current of 79 mA. Ideal for applications requiring high-speed data conversion in compact spaces.

Median Price

$67.830

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23,374 parts In-Stock

1+ parts

$67.830

100+ parts

$65.790

1k+ parts

$51.000

10k+ parts

-

23,374

$67.830

$65.790

$51.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 860 parts In-Stock

1+ parts

$64.438

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$64.438

-

-

-

Vyrian

USA . 3,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,412

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,051 parts In-Stock

1+ parts

$19.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,051

$19.250

-

-

-

Parana Technologies

USA . 4 parts In-Stock

1+ parts

$23.729

100+ parts

-

1k+ parts

$24.359

10k+ parts

-

4

$23.729

-

$24.359

-

DigiPath Technology Company

USA . 1,772 parts In-Stock

1+ parts

$26.129

100+ parts

$24.038

1k+ parts

-

10k+ parts

-

1,772

$26.129

$24.038

-

-

ChromeModa Solutions

Germany . 5,632 parts In-Stock

1+ parts

$26.662

100+ parts

$21.863

1k+ parts

-

10k+ parts

-

5,632

$26.662

$21.863

-

-

IDEA Electronic Components Group

UK . 1,708 parts In-Stock

1+ parts

$26.662

100+ parts

$25.329

1k+ parts

$23.996

10k+ parts

-

1,708

$26.662

$25.329

$23.996

-

Semicontronic

India . 23,106 parts In-Stock

1+ parts

$57.660

100+ parts

$56.218

1k+ parts

$55.930

10k+ parts

-

23,106

$57.660

$56.218

$55.930

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Ampacity Inc.

Singapore . 23,074 parts In-Stock

1+ parts

$57.660

100+ parts

-

1k+ parts

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10k+ parts

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23,074

$57.660

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-

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Corphita

USA . 192 parts In-Stock

1+ parts

$61.047

100+ parts

-

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192

$61.047

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Corohmni

South Africa . 480 parts In-Stock

1+ parts

$67.830

100+ parts

-

1k+ parts

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10k+ parts

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480

$67.830

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 3,192 parts In-Stock

1+ parts

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100+ parts

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3,192

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Native Components

USA . 755 parts In-Stock

1+ parts

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755

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Northwest PG Solutions

USA . 139 parts In-Stock

1+ parts

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139

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Overview

Enhance your analog-to-digital conversion with the Texas Instruments ADC3644IRSBR. Crafted by a renowned manufacturer, this high-quality converter offers unparalleled precision and reliability. With applications spanning across industries, this product provides exceptional value to customers seeking top-notch performance. Experience the benefits of seamless integration, superior accuracy, and efficient operation with the ADC3644IRSBR. Upgrade your systems today and elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and can withstand various environmental conditions, making it a reliable choice for long-term use.

No. of Analog In Channels: 2

Having 2 analog input channels allows for versatile input options and enables the conversion of multiple analog signals simultaneously.

Surface Mount: YES

Surface mount capability makes installation easier and ensures a secure connection, making the product suitable for modern compact electronic designs.

No. of Bits: 14

With 14 bits, the analog-to-digital converter offers high resolution conversion, providing more accurately digitized analog signals.

Maximum Linearity Error (EL): 0.045776 %

The low linearity error percentage ensures accurate conversion, making this product suitable for applications where precision is crucial.

No. of Terminals: 40

Having 40 terminals allows for versatile connectivity options and integration with various electronic systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style offers efficient heat dissipation, compact design, and easy integration into electronic devices with limited space.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance enables the product to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance ensures the product can operate in colder environments without performance issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission over time.

Terminal Position: QUAD

The quad terminal position enhances stability and connectivity, making the product suitable for applications requiring secure terminal connections.

Maximum Seated Height: 0.8 mm

The low seated height facilitates slim device designs and improves overall product aesthetics.

Width: 5 mm

The compact width dimension allows for easy integration into electronic systems with limited space.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the soldering process during manufacturing without damage.

Length: 5 mm

The compact length dimension allows for space-efficient integration into electronic designs.

Maximum Analog Input Voltage: 2.25 V

The high maximum analog input voltage tolerance allows for accurate digitization of larger amplitude analog signals.

Sample Rate: 125 MHz

The high sample rate enables fast and efficient analog-to-digital conversion, making this product suitable for applications requiring real-time data processing.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related issues and ensures environmental compliance.

Maximum Supply Current: 79 mA

The low maximum supply current requirement reduces power consumption, making the product energy-efficient.

Converter Type: ADC, PROPRIETARY METHOD

The ADC using a proprietary conversion method offers unique performance advantages and customization options, making it suitable for specialized applications.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage requirement minimizes power consumption and offers compatibility with a wide range of electronic devices.

Output Bit Code: 2S COMPLEMENT, OFFSET BINARY

The output bit code options provide flexibility in data representation and processing, making the product versatile for different applications.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for close terminal spacing, enabling compact device designs and efficient PCB layouts.

Minimum Analog Input Voltage: -2.25 V

The low minimum analog input voltage tolerance allows for accurate digitization of smaller amplitude analog signals with high precision.

Output Format: SERIAL, PARALLEL, WORD

The multiple output format options provide compatibility with different digital systems and data processing methods, enhancing the product's versatility.

Moisture Sensitivity Level (MSL): 3

The MSL 3 designation indicates the product's resistance to moisture-related issues during storage and handling, ensuring long-term reliability.

Technical Specifications

Analog-to-Digital Converters ADC3644IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

2’s Complement, Offset Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.045776 %

Sample Rate:

125 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-2.25 V

Maximum Analog Input Voltage:

2.25 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

79 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3644IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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