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ADC3581IRSBR

Texas Instruments

ADC3581IRSBR by Texas Instruments

Texas Instruments ADC3581IRSBR is an 18-bit ADC with 0.0061035% EL, 10 MHz sample rate, and 3.2V max analog input voltage. Ideal for applications requiring high precision data conversion in a compact form factor like industrial automation and medical devices.

Median Price

$53.550

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,817 parts In-Stock

1+ parts

$53.550

100+ parts

$47.600

1k+ parts

$35.000

10k+ parts

-

8,817

$53.550

$47.600

$35.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,540 parts In-Stock

1+ parts

$50.872

100+ parts

-

1k+ parts

-

10k+ parts

-

1,540

$50.872

-

-

-

Vyrian

USA . 7,319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,319

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,123 parts In-Stock

1+ parts

$21.340

100+ parts

-

1k+ parts

-

10k+ parts

-

1,123

$21.340

-

-

-

Ampacity Inc.

Singapore . 8,794 parts In-Stock

1+ parts

$45.520

100+ parts

-

1k+ parts

-

10k+ parts

-

8,794

$45.520

-

-

-

Corphita

USA . 1,348 parts In-Stock

1+ parts

$48.195

100+ parts

-

1k+ parts

-

10k+ parts

-

1,348

$48.195

-

-

-

Corohmni

South Africa . 365 parts In-Stock

1+ parts

$53.550

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$53.550

-

-

-

Semicontronic

India . 8,352 parts In-Stock

1+ parts

$99.070

100+ parts

$96.593

1k+ parts

$96.098

10k+ parts

-

8,352

$99.070

$96.593

$96.098

-

Microchip USA

USA . 1,104 parts In-Stock

1+ parts

$100.630

100+ parts

$98.880

1k+ parts

$98.000

10k+ parts

$97.130

1,104

$100.630

$98.880

$98.000

$97.130

Northwest PG Solutions

USA . 1,803 parts In-Stock

1+ parts

-

100+ parts

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1,803

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Native Components

USA . 533 parts In-Stock

1+ parts

-

100+ parts

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533

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Overview

Experience unparalleled precision and performance with the ADC3581IRSBR by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers top-notch quality and reliability. This versatile chip carrier is perfect for a wide range of applications, offering a maximum linearity error of just 0.0061035% and a sample rate of 10 MHz. With a nominal supply voltage of 1.8V and a maximum operating temperature of 105°C, this ADC provides exceptional value and benefits to customers seeking high-quality solutions. Dive into the world of cutting-edge technology with the ADC3581IRSBR and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protects the internal components of the converter, ensuring long-term reliability.

No. of Bits: 18

With 18 bits resolution, this converter can provide high precision in converting analog signals to digital data, suitable for applications requiring accurate measurements.

Maximum Linearity Error (EL): 0.0061035%

The low linearity error ensures that the output digital data closely matches the input analog signal, making the converter highly reliable for precise measurements.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this converter can withstand harsh environmental conditions, making it suitable for a wide range of industrial applications.

Sample Rate: 10 MHz

The high sample rate of 10 MHz allows the converter to capture and convert analog signals quickly, making it suitable for high-speed signal processing applications.

Technical Specifications

Analog-to-Digital Converters ADC3581IRSBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Output Bit Code:

2’s Complement, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061035 %

Sample Rate:

10 MHz

Electrical Specifications

Minimum Analog Input Voltage:

-3.2 V

Maximum Analog Input Voltage:

3.2 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

27 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.016 in (0.4 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC40,.20SQ,16

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Trade Compliance

ADC3581IRSBR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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