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ADC34J25IRGZ25

Texas Instruments

ADC34J25IRGZ25 by Texas Instruments

Texas Instruments ADC34J25IRGZ25 is a 12-bit ADC with 4 analog in channels, operating at 160 MHz sample rate. Ideal for industrial applications, it has a max analog input voltage of ±2V and operates b/w -40 to 85°C. This surface-mount chip carrier package features a very thin profile and no-lead terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,119 parts In-Stock

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Digiode

USA . 4,781 parts In-Stock

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4,781

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Distributors (Availability)

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Native Components

USA . 286 parts In-Stock

1+ parts

$1.906

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286

$1.906

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Northwest PG Solutions

USA . 495 parts In-Stock

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$2.097

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495

$2.097

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Ampacity Inc.

Singapore . 588 parts In-Stock

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$11.000

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588

$11.000

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AZTECH Wire

Italy . 535 parts In-Stock

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$17.282

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535

$17.282

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Parana Technologies

USA . 457 parts In-Stock

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$18.460

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$18.578

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457

$18.460

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$18.578

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One Stop Electronics

USA . 229 parts In-Stock

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$19.000

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229

$19.000

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DigiPath Technology Company

USA . 817 parts In-Stock

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$20.327

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817

$20.327

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ChromeModa Solutions

Germany . 2,667 parts In-Stock

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$20.742

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$17.008

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$20.742

$17.008

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IDEA Electronic Components Group

UK . 1,331 parts In-Stock

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$20.742

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$19.705

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$18.668

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1,331

$20.742

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$18.668

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Corphita

USA . 555 parts In-Stock

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555

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Microchip USA

USA . 284 parts In-Stock

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Overview

Unlock the power of precision with the ADC34J25IRGZ25 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This Analog-to-Digital Converter boasts 4 analog input channels and a sample rate of 160 MHz, making it ideal for a variety of industrial applications. Its compact design and high performance ensure accurate and efficient data conversion. Experience the value and benefits of Texas Instruments technology with the ADC34J25IRGZ25 - your key to seamless integration and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making this product reliable for long-term use.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple inputs to be converted simultaneously, increasing the efficiency of data conversion.

No. of Bits: 12

With 12 bits of resolution, this ADC can provide more accurate and detailed digital representations of analog signals.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V makes this product energy-efficient and suitable for applications where power consumption is a concern.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that this ADC can perform reliably in various environmental conditions.

Sample Rate: 160 MHz

With a high sample rate of 160 MHz, this ADC can accurately capture fast-changing analog signals, making it ideal for high-speed applications.

Technical Specifications

Analog-to-Digital Converters ADC34J25IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

160 MHz

Electrical Specifications

Power Supplies:

1.8 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

1.8 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADC34J25IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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