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ADC32RF83IRMPR

Texas Instruments

ADC32RF83IRMPR by Texas Instruments

Texas Instruments ADC32RF83IRMPR is a 72-terminal IC with data rate of 12500 Mbps. Operating at -40 to 85°C, it's ideal for telecom circuits with a supply voltage of 1.15V. The chip carrier package style has a very thin profile and nickel/palladium/gold terminal finish.

Median Price

$1,162.355

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,503 parts In-Stock

1+ parts

$1,162.355

100+ parts

$922.504

1k+ parts

-

10k+ parts

-

1,503

$1,162.355

$922.504

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,637 parts In-Stock

1+ parts

$1,104.237

100+ parts

-

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-

10k+ parts

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4,637

$1,104.237

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-

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Vyrian

USA . 7,212 parts In-Stock

1+ parts

-

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-

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7,212

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Chip Stock

USA . 345 parts In-Stock

1+ parts

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345

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,183 parts In-Stock

1+ parts

$9.711

100+ parts

-

1k+ parts

$10.292

10k+ parts

-

1,183

$9.711

-

$10.292

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ChromeModa Solutions

Germany . 4,195 parts In-Stock

1+ parts

$10.911

100+ parts

$8.947

1k+ parts

-

10k+ parts

-

4,195

$10.911

$8.947

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IDEA Electronic Components Group

UK . 695 parts In-Stock

1+ parts

$10.911

100+ parts

$10.365

1k+ parts

$9.820

10k+ parts

-

695

$10.911

$10.365

$9.820

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AZTECH Wire

Italy . 1,219 parts In-Stock

1+ parts

$15.400

100+ parts

-

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1,219

$15.400

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Microchip USA

USA . 1,448 parts In-Stock

1+ parts

$772.140

100+ parts

$560.880

1k+ parts

$546.120

10k+ parts

$531.360

1,448

$772.140

$560.880

$546.120

$531.360

Corphita

USA . 4,308 parts In-Stock

1+ parts

$1,046.120

100+ parts

-

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4,308

$1,046.120

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Lixinc

USA . 4,648 parts In-Stock

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4,648

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DigiPath Technology Company

USA . 2,177 parts In-Stock

1+ parts

-

100+ parts

$9.837

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10k+ parts

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2,177

-

$9.837

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Northwest PG Solutions

USA . 708 parts In-Stock

1+ parts

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708

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Native Components

USA . 335 parts In-Stock

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335

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Overview

Unleash the power of cutting-edge technology with the ADC32RF83IRMPR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. This Telecom Interface IC is perfect for a wide range of applications, offering seamless integration and high performance. Experience the value and benefits of this product, from its compact design to its industrial-grade temperature range. Elevate your projects and stay ahead of the curve with the ADC32RF83IRMPR.

Feature Benefit Bullets

Surface Mount: YES

Easy to install and saves space on PCB.

Package Shape: SQUARE

Efficient use of board space and easy to integrate into design.

No. of Terminals: 72

Allows for connectivity with multiple components and peripherals.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in various conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides a reliable and durable connection for long-term use.

Width: 10 mm

Compact size for easy integration into designs with space constraints.

Data Rate: 12500 Mbps

High data rate allows for fast and efficient communication.

Technical Specifications

Other Function Telecom Interface ICs ADC32RF83IRMPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

12500 Mbps

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

ADC32RF83IRMPR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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