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ADC32RF80IRMPR

Texas Instruments

ADC32RF80IRMPR by Texas Instruments

Texas Instruments ADC32RF80IRMPR is a 72-terminal IC with data rate of 12500 Mbps. It operates b/w -40 to 85 °C, suitable for telecom circuits. The chip carrier package style has a very thin profile and terminal finish of Ni/Pd/Au.

Median Price

$1,278.225

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,340 parts In-Stock

1+ parts

$1,278.225

100+ parts

$1,014.464

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1,340

$1,278.225

$1,014.464

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Distributors (In-Stock)

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Digiode

USA . 877 parts In-Stock

1+ parts

$1,214.314

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877

$1,214.314

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Vyrian

USA . 4,491 parts In-Stock

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4,491

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Chip Stock

USA . 1,045 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 242 parts In-Stock

1+ parts

$0.197

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-

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$0.189

242

$0.197

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$0.189

Northwest PG Solutions

USA . 336 parts In-Stock

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$0.217

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-

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$0.191

336

$0.217

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$0.191

Parana Technologies

USA . 805 parts In-Stock

1+ parts

$11.131

100+ parts

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$11.584

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805

$11.131

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$11.584

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ChromeModa Solutions

Germany . 5,913 parts In-Stock

1+ parts

$12.507

100+ parts

$10.256

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5,913

$12.507

$10.256

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$12.507

100+ parts

$11.882

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$11.256

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1,962

$12.507

$11.882

$11.256

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AZTECH Wire

Italy . 684 parts In-Stock

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$17.530

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Component Stockers USA

USA . 79 parts In-Stock

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$658.500

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79

$658.500

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Microchip USA

USA . 1,112 parts In-Stock

1+ parts

$849.110

100+ parts

$616.790

1k+ parts

$600.560

10k+ parts

$584.330

1,112

$849.110

$616.790

$600.560

$584.330

Corphita

USA . 516 parts In-Stock

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$1,150.402

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516

$1,150.402

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Perfect Parts

USA . 47,040 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,363 parts In-Stock

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Lixinc

USA . 19,083 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,912 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,608 parts In-Stock

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4,608

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DigiPath Technology Company

USA . 789 parts In-Stock

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$11.276

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789

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$11.276

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Metaverse IC Inc.

Canada . 450 parts In-Stock

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Futuretech Components

Singapore . 200 parts In-Stock

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200

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Overview

Discover the cutting-edge ADC32RF80IRMPR by Texas Instruments, a top-of-the-line telecom interface IC that promises unmatched quality and reliability. With its sleek surface mount design and industrial-grade temperature tolerance, this innovative product offers seamless integration and optimal performance in a wide range of applications. Trust in Texas Instruments' reputation for excellence and elevate your projects with the superior value and benefits of the ADC32RF80IRMPR.

Feature Benefit Bullets

Surface Mount: YES

The ability to be surface mounted makes installation easier and more efficient, saving time and effort during production.

Package Shape: SQUARE

The square package shape allows for compact and space-saving design, making it ideal for applications where size is limited.

No. of Terminals: 72

With a high number of terminals, this product offers a wide range of connectivity options, making it versatile and suitable for various applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package style offers efficient heat dissipation and compact design, ideal for high-performance and space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in a wide range of temperature conditions, increasing its versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring long-term reliability and performance of the product.

Terminal Position: QUAD

The quad terminal position enables easy and secure connections, enhancing the overall reliability and stability of the product.

Maximum Seated Height: 0.9 mm

The low maximum seated height allows for a slim and compact design, suitable for applications where space is limited.

Width: 10 mm

With a width of 10mm, this product can easily fit into various electronic devices and equipment, offering flexibility in design and integration.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures efficient soldering and assembly processes, contributing to overall manufacturing efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables reliable soldering and ensures the integrity of the product during assembly.

Length: 10 mm

With a length of 10mm, this product offers a compact form factor, making it suitable for applications where space-saving is crucial.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can withstand harsh environmental conditions and operate reliably in industrial settings.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and compliant with regulations, making it a sustainable choice for electronic manufacturers.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product offers optimized performance and features tailored for telecommunication systems.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage of 1.15V ensures compatibility with standard power sources, making integration easier in various systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and compact designs, ideal for space-constrained applications.

Data Rate: 12500 Mbps

With a high data rate of 12500 Mbps, this product is capable of handling large volumes of data quickly and efficiently, making it suitable for high-speed communication applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this product has a moderate sensitivity to moisture exposure, requiring standard handling procedures during storage and assembly.

Technical Specifications

Other Function Telecom Interface ICs ADC32RF80IRMPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

12500 Mbps

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

ADC32RF80IRMPR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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