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ADC32RF80IRRHR

Texas Instruments

ADC32RF80IRRHR by Texas Instruments

Texas Instruments' ADC32RF80IRRHR is a 72-terminal telecom IC with data rate of 12500 Mbps. It operates b/w -40 to 85°C, suitable for industrial use. The chip carrier package style with very thin profile and no-lead terminal form makes it ideal for telecom circuit applications.

Median Price

$1,014.464

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,360 parts In-Stock

1+ parts

$1,014.464

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2,360

$1,014.464

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Distributors (In-Stock)

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Digiode

USA . 1,588 parts In-Stock

1+ parts

$963.741

100+ parts

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1,588

$963.741

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Vyrian

USA . 3,554 parts In-Stock

1+ parts

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3,554

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Chip Stock

USA . 200 parts In-Stock

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 257 parts In-Stock

1+ parts

$0.045

100+ parts

-

1k+ parts

-

10k+ parts

$0.043

257

$0.045

-

-

$0.043

Parana Technologies

USA . 2,186 parts In-Stock

1+ parts

$9.933

100+ parts

$922.457

1k+ parts

$8.940

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-

2,186

$9.933

$922.457

$8.940

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AZTECH Wire

Italy . 153 parts In-Stock

1+ parts

$10.200

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153

$10.200

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DigiPath Technology Company

USA . 468 parts In-Stock

1+ parts

$10.938

100+ parts

$10.063

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468

$10.938

$10.063

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IDEA Electronic Components Group

UK . 1,315 parts In-Stock

1+ parts

$11.161

100+ parts

$10.603

1k+ parts

$10.045

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-

1,315

$11.161

$10.603

$10.045

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ChromeModa Solutions

Germany . 22 parts In-Stock

1+ parts

$11.161

100+ parts

$9.152

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22

$11.161

$9.152

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Microchip USA

USA . 2,423 parts In-Stock

1+ parts

$849.110

100+ parts

$616.790

1k+ parts

$600.560

10k+ parts

$584.330

2,423

$849.110

$616.790

$600.560

$584.330

Corphita

USA . 2,660 parts In-Stock

1+ parts

$913.018

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2,660

$913.018

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Northwest PG Solutions

USA . 1,452 parts In-Stock

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1,452

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Overview

Unlock the potential of your telecom applications with the Texas Instruments ADC32RF80IRRHR. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. The ADC32RF80IRRHR is a game-changer, offering high-speed data rate, industrial temperature grade, and a compact square package design. With its advanced features and reliable performance, this telecom interface IC is perfect for a wide range of applications. Experience the value and benefits that only Texas Instruments can provide with the ADC32RF80IRRHR.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: SQUARE

Square package shape provides efficient use of board space and simplified routing of traces.

No. of Terminals: 72

With 72 terminals, this product can accommodate a variety of connectivity options and interfaces.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for reliable connections.

Width: 10 mm

Compact width of 10 mm enables space-saving design and integration into various applications.

Data Rate: 12500 Mbps

High data rate of 12500 Mbps allows for fast and efficient data transmission, crucial for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ADC32RF80IRRHR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

12500 Mbps

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC72,.39SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

ADC32RF80IRRHR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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