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ADC32RF83IRRHT

Texas Instruments

ADC32RF83IRRHT by Texas Instruments

Texas Instruments' ADC32RF83IRRHT is a 72-terminal telecom IC with data rate of 12500 Mbps. Operating b/w -40 to 85°C, it features a square chip carrier package style and nickel palladium gold finish. Ideal for high-speed communication applications in industrial settings.

Median Price

$1,072.425

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,379 parts In-Stock

1+ parts

$1,072.425

100+ parts

$970.729

1k+ parts

$924.504

10k+ parts

-

2,379

$1,072.425

$970.729

$924.504

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 776 parts In-Stock

1+ parts

$1,018.804

100+ parts

-

1k+ parts

-

10k+ parts

-

776

$1,018.804

-

-

-

Vyrian

USA . 8,985 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,985

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 862 parts In-Stock

1+ parts

$11.010

100+ parts

-

1k+ parts

$11.473

10k+ parts

-

862

$11.010

-

$11.473

-

DigiPath Technology Company

USA . 2,156 parts In-Stock

1+ parts

$12.124

100+ parts

-

1k+ parts

-

10k+ parts

-

2,156

$12.124

-

-

-

ChromeModa Solutions

Germany . 3,689 parts In-Stock

1+ parts

$12.371

100+ parts

$10.144

1k+ parts

-

10k+ parts

-

3,689

$12.371

$10.144

-

-

IDEA Electronic Components Group

UK . 1,318 parts In-Stock

1+ parts

$12.371

100+ parts

$11.752

1k+ parts

$11.134

10k+ parts

-

1,318

$12.371

$11.752

$11.134

-

AZTECH Wire

Italy . 478 parts In-Stock

1+ parts

$14.050

100+ parts

-

1k+ parts

-

10k+ parts

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478

$14.050

-

-

-

Microchip USA

USA . 1,569 parts In-Stock

1+ parts

$773.810

100+ parts

$562.100

1k+ parts

$547.310

10k+ parts

$532.510

1,569

$773.810

$562.100

$547.310

$532.510

Corphita

USA . 323 parts In-Stock

1+ parts

$965.182

100+ parts

-

1k+ parts

-

10k+ parts

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323

$965.182

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-

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Northwest PG Solutions

USA . 783 parts In-Stock

1+ parts

-

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783

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Native Components

USA . 248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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248

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-

-

-

Overview

Unlock the power of seamless connectivity with the Texas Instruments ADC32RF83IRRHT. Crafted with precision and excellence, this telecom interface IC offers unparalleled reliability and performance. Designed to meet industrial standards, this chip carrier package ensures optimal operation even in the most demanding conditions. Perfect for a wide range of applications, from telecommunications to data transmission, this product delivers high-speed data rates and efficient operation. Elevate your projects with the quality and innovation that Texas Instruments is renowned for, and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB, saving time and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the PCB, especially in applications where space is limited.

No. of Terminals: 72

Having a higher number of terminals allows for more connectivity options, making the product versatile for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures that the product can function reliably in harsh environments without overheating.

Width: 10 mm

The compact width of the product makes it suitable for applications where space-saving is crucial.

Data Rate: 12500 Mbps

The high data rate capability of the product enables fast and efficient data transfer, ideal for telecommunications applications.

Technical Specifications

Other Function Telecom Interface ICs ADC32RF83IRRHT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

12500 Mbps

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

72

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC72,.39SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

ADC32RF83IRRHT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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