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7600201FX

Texas Instruments

7600201FX by Texas Instruments

The Texas Instruments 7600201FX is a ceramic/glass-sealed multiplexer with 4 functions, 2 inputs, and a propagation delay of 14ns. Operating b/w -55°C to 125°C, it has a supply voltage range of 4.5V to 5.5V. Ideal for military-grade applications requiring high-speed signal switching in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,972 parts In-Stock

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4,972

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Anansix

USA . 1,013 parts In-Stock

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1,013

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Digiode

USA . 447 parts In-Stock

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447

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Electronic Expediters

USA . 75 parts In-Stock

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75

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Distributors (Availability)

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Native Components

USA . 543 parts In-Stock

1+ parts

$1.580

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543

$1.580

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Northwest PG Solutions

USA . 1,257 parts In-Stock

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$1.738

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$1.738

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AZTECH Wire

Italy . 573 parts In-Stock

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$16.775

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573

$16.775

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Parana Technologies

USA . 2,001 parts In-Stock

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$26.970

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$30.679

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2,001

$26.970

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$30.679

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ChromeModa Solutions

Germany . 2,913 parts In-Stock

1+ parts

$30.303

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$24.848

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2,913

$30.303

$24.848

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IDEA Electronic Components Group

UK . 2,149 parts In-Stock

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$30.303

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$28.788

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$27.273

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2,149

$30.303

$28.788

$27.273

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One Stop Electronics

USA . 802 parts In-Stock

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$34.000

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802

$34.000

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Corphita

USA . 3,021 parts In-Stock

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3,021

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DigiPath Technology Company

USA . 281 parts In-Stock

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$27.321

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281

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$27.321

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the 7600201FX multiplexer & demultiplexer. This versatile component is designed to streamline your circuit design process, offering a compact package body material and military-grade screening level for optimal performance in a wide range of applications. From aerospace to telecommunications, this product delivers exceptional value and efficiency, making it the perfect choice for your next project. Trust Texas Instruments to provide innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent durability and reliability, making it suitable for harsh operating environments.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 4

Offers versatility and flexibility in signal routing and processing, allowing for complex operations to be performed.

Screening Level: MIL-STD-883

Ensures high quality and reliability, meeting military standards for rugged and dependable performance.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with common power sources.

No. of Inputs: 2

Provides a balanced input configuration, enabling efficient signal multiplexing and demultiplexing.

Package Shape: RECTANGULAR

Facilitates easy integration into circuit designs, optimizing space utilization and layout efficiency.

Propagation Delay (tpd): 14 ns

Delivers fast signal processing speeds, enabling quick response times in data transmission.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high temperature environments, making it suitable for a wide range of applications.

Technology: TTL

Utilizes proven TTL technology for efficient and reliable signal processing, ensuring compatibility with existing systems.

Technical Specifications

Multiplexer & Demultiplexer 7600201FX attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

Length:

10.16 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

14 ns

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

6.73 mm

Trade Compliance

7600201FX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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