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74VMEH22501ADGGRG4

Texas Instruments

74VMEH22501ADGGRG4 by Texas Instruments

74VMEH22501ADGGRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 14.5ns, operating at a nominal voltage of 3.3V. It features a small outline package style and is suitable for industrial applications requiring bidirectional control with common control functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,195 parts In-Stock

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4,195

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Digiode

USA . 1,437 parts In-Stock

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1,437

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Distributors (Availability)

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Andel Nordic

Denmark . 3,528 parts In-Stock

1+ parts

$3.084

100+ parts

-

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$2.960

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$2.960

3,528

$3.084

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$2.960

$2.960

Native Components

USA . 898 parts In-Stock

1+ parts

$5.790

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898

$5.790

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One Stop Electronics

USA . 126 parts In-Stock

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$16.000

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126

$16.000

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AZTECH Wire

Italy . 700 parts In-Stock

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$18.884

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700

$18.884

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Parana Technologies

USA . 1,841 parts In-Stock

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$21.374

100+ parts

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$21.712

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1,841

$21.374

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$21.712

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DigiPath Technology Company

USA . 231 parts In-Stock

1+ parts

$23.536

100+ parts

$21.653

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231

$23.536

$21.653

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ChromeModa Solutions

Germany . 6,416 parts In-Stock

1+ parts

$24.016

100+ parts

$19.693

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6,416

$24.016

$19.693

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IDEA Electronic Components Group

UK . 1,112 parts In-Stock

1+ parts

$24.016

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$22.815

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$21.614

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1,112

$24.016

$22.815

$21.614

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Corphita

USA . 3,029 parts In-Stock

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3,029

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Northwest PG Solutions

USA . 625 parts In-Stock

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$5.674

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625

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$5.674

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Overview

Elevate your electronic designs with the Texas Instruments 74VMEH22501ADGGRG4 bus driver & transceiver. Crafted by a trusted industry leader, this product delivers superior quality and reliability. Perfect for a wide range of applications, this 8-bit device offers lightning-fast speeds with a propagation delay of just 14.5 ns. With a compact design and advanced features like 3-state output with series resistor, this component provides exceptional value and performance to meet all your needs. Upgrade your projects today with the Texas Instruments advantage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and reliability for the product.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast and efficient data transmission in the bus driver.

Surface Mount: YES

Surface mount design makes the product easy to install and saves space on PCB.

No. of Bits: 8

8-bit functionality allows for a wide range of data transmission capabilities.

Nominal Supply Voltage / Vsup (V): 3.3

Nominal supply voltage of 3.3V is commonly used in many electronic systems, making it compatible with various applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environmental conditions.

Maximum Power Supply Current (ICC): 30 mA

Low power consumption helps in energy efficiency and prolonging battery life.

Technical Specifications

Bus Driver & Transceivers 74VMEH22501ADGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO 1-BIT TRANSCEIVERS ALSO AVAILABLE

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

74V

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

10.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74VMEH22501ADGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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