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74VMEH22501ADGVRE4

Texas Instruments

74VMEH22501ADGVRE4 by Texas Instruments

74VMEH22501ADGVRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 14.5ns at 3.3V, suitable for industrial applications. It features a max I (ol) of 12A, operates b/w -40 to 85°C, and has a small outline package style. This CMOS technology transceiver has dual terminal position and supports bidirectional count direction.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 1,981 parts In-Stock

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Digiode

USA . 1,807 parts In-Stock

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Andel Nordic

Denmark . 169 parts In-Stock

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$6.380

100+ parts

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$6.125

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$6.125

169

$6.380

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$6.125

$6.125

AZTECH Wire

Italy . 632 parts In-Stock

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$9.158

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Parana Technologies

USA . 932 parts In-Stock

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$19.600

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$19.596

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932

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ChromeModa Solutions

Germany . 4,786 parts In-Stock

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$22.023

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$18.059

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IDEA Electronic Components Group

UK . 2,186 parts In-Stock

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$22.023

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$20.922

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$19.821

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One Stop Electronics

USA . 470 parts In-Stock

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$61.000

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DigiPath Technology Company

USA . 1,820 parts In-Stock

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$19.856

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Corphita

USA . 1,700 parts In-Stock

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Northwest PG Solutions

USA . 990 parts In-Stock

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$4.498

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Native Components

USA . 356 parts In-Stock

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Overview

Enhance your electronic designs with the 74VMEH22501ADGVRE4 by Texas Instruments, a top-tier manufacturer known for delivering reliable and high-quality components. This bus driver & transceiver offers seamless integration, fast propagation delay, and versatile applications in various industries. With a wide range of benefits such as low power consumption, compact design, and superior performance, this product provides exceptional value to customers looking for efficient solutions for their projects. Upgrade your systems with Texas Instruments and experience innovation at its best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to damage, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 14.5 ns

Low propagation delay ensures fast signal transmission and response times, essential for efficient communication within a bus system.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making it convenient for integration into compact bus systems.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard 3.3V power supplies, ensuring easy integration with existing bus systems.

No. of Terminals: 48

Sufficient number of terminals for connecting multiple components, enabling versatile use in bus driver applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the product to withstand varying environmental conditions, increasing its reliability.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output allows for high impedance state, enabling bus sharing and reducing interference, while the series resistor helps to limit current flow, protecting the circuit.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures precise timing control, essential for synchronized data transmission in bus communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy bus environments.

Maximum Supply Voltage (Vsup): 3.45 V

With a maximum supply voltage slightly above the nominal voltage, the product provides a safety margin against voltage fluctuations, enhancing the overall stability of the bus system.

Technical Specifications

Bus Driver & Transceivers 74VMEH22501ADGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO 1-BIT TRANSCEIVERS ALSO AVAILABLE

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

74V

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

14.5 ns

Propagation Delay (tpd):

10.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74VMEH22501ADGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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