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74LVC2G126DCURE4

Texas Instruments

74LVC2G126DCURE4 by Texas Instruments

74LVC2G126DCURE4 by Texas Instruments is a bus driver with 2 functions, featuring a propagation delay of 4 ns and operating temperature range from -40 to 85 °C. It is ideal for industrial applications requiring true output polarity and a supply voltage range of 1.65V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,339 parts In-Stock

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Vyrian

USA . 2,957 parts In-Stock

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2,957

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One Stop Electronics

USA . 531 parts In-Stock

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$3.000

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531

$3.000

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Native Components

USA . 407 parts In-Stock

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$6.657

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407

$6.657

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Parana Technologies

USA . 1,799 parts In-Stock

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$11.040

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$11.500

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1,799

$11.040

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$11.500

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DigiPath Technology Company

USA . 1,145 parts In-Stock

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$12.157

100+ parts

$11.184

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1,145

$12.157

$11.184

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ChromeModa Solutions

Germany . 3,629 parts In-Stock

1+ parts

$12.405

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$10.172

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3,629

$12.405

$10.172

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IDEA Electronic Components Group

UK . 405 parts In-Stock

1+ parts

$12.405

100+ parts

$11.785

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$11.164

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405

$12.405

$11.785

$11.164

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AZTECH Wire

Italy . 864 parts In-Stock

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$18.623

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864

$18.623

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QUARKTWIN TECHNOLOGY LTD

USA . 26,983 parts In-Stock

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Microchip USA

USA . 5,074 parts In-Stock

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Corphita

USA . 2,335 parts In-Stock

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Northwest PG Solutions

USA . 719 parts In-Stock

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$6.524

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719

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$6.524

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Overview

Unlock the potential of your electronic designs with the 74LVC2G126DCURE4 by Texas Instruments, a high-quality bus driver and transceiver. Texas Instruments is known for its reliable and innovative products, and this one is no exception. Ideal for applications requiring fast signal transmission and low power consumption, this device offers customers value, efficiency, and performance. Say goodbye to delays and hello to seamless communication with the 74LVC2G126DCURE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 4 ns

With a low propagation delay, this product ensures fast and efficient signal transmission, making it suitable for high-speed communication systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the product on circuit boards, saving space and facilitating mass production.

No. of Functions: 2

Having multiple functions in a single component improves the overall system integration and reduces the need for additional components, leading to cost savings.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a relatively low supply voltage of 1.8V ensures energy efficiency and compatibility with low-power devices, making it a versatile choice for various applications.

Load Capacitance (CL): 50 pF

With a specified load capacitance, the product can effectively drive connected devices without signal degradation, ensuring reliable performance in different operating conditions.

Power Supplies (V): 3.3

The compatibility with a standard power supply voltage of 3.3V makes the product easy to integrate into existing systems and simplifies the design process.

No. of Terminals: 8

Having multiple terminals allows for flexible connectivity options, enabling the product to interface with other components or devices, enhancing overall functionality.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The compact and slim package style with a shrink pitch design saves space on the PCB, making it suitable for applications with size constraints.

Maximum I (ol): 24 Amp

The high output current capability of 24A ensures that the product can drive demanding loads effectively, making it suitable for applications requiring robust performance.

Propagation Delay (tpd): 9.8 ns

With a low propagation delay of 9.8ns, the product ensures fast signal transmission, reducing latency and improving overall system efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance in harsh environmental conditions, making the product suitable for industrial applications.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in signal control, allowing the product to effectively interface with multiple devices or systems.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40°C to 85°C ensures reliable operation in extreme temperature environments, enhancing the product's versatility and reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent corrosion resistance and ensures stable electrical connections, improving the product's longevity and performance.

Terminal Position: DUAL

Having dual terminal positions allows for versatile mounting options and facilitates easier PCB layout, enhancing the product's compatibility and ease of use.

No. of Ports: 2

With two ports, the product can efficiently handle input and output signals simultaneously, enabling effective communication between connected devices or systems.

Maximum Seated Height: 0.9 mm

The compact maximum seated height of 0.9mm ensures a low-profile design, making the product suitable for applications with space constraints or height limitations.

Width: 2 mm

The narrow width of 2mm allows for efficient use of space on the PCB, enabling compact system designs and enhancing overall product integration.

Output Polarity: TRUE

Having true output polarity simplifies signal interpretation and enables easy integration into various circuit configurations, enhancing usability and compatibility.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage of 1.65V ensures operational flexibility and compatibility with a wide range of power sources, making the product versatile and adaptable.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the product allows for efficient soldering processes, ensuring reliable and consistent assembly results.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables robust soldering connections, ensuring product durability and reliability in challenging operating conditions.

Length: 2.3 mm

The compact length of 2.3mm contributes to a space-saving design, making the product suitable for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding environments, making the product suitable for industrial automation and control applications.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy surface mounting and soldering processes, ensuring secure connections and simplifying the assembly of the product.

Packing Method: TR

The TR packing method offers efficient handling and storage of the product, simplifying logistics and ensuring product integrity during transportation and distribution.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting on the PCB, enabling compact designs and enhancing overall system performance.

Control Type: ENABLE HIGH

The enable high control type provides easy signal manipulation and management, allowing for seamless integration into digital systems and enhancing overall operational control.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, the product can accommodate a wide range of power sources, ensuring compatibility with diverse system requirements.

Technical Specifications

Bus Driver & Transceivers 74LVC2G126DCURE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE HIGH

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

9.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

74LVC2G126DCURE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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