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74GTLPH16912VRE4

Texas Instruments

74GTLPH16912VRE4 by Texas Instruments

74GTLPH16912VRE4 by Texas Instruments is an 18-bit bus driver with GTL/P & LVTTL translation, operating at a nominal voltage of 3.3V. With a propagation delay of 6.5ns and output polarity as TRUE, it is ideal for industrial applications requiring bidirectional control in a compact package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,689 parts In-Stock

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Digiode

USA . 50 parts In-Stock

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50

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Native Components

USA . 848 parts In-Stock

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$6.827

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848

$6.827

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AZTECH Wire

Italy . 699 parts In-Stock

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$9.233

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699

$9.233

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Parana Technologies

USA . 77 parts In-Stock

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$15.895

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$16.251

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77

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DigiPath Technology Company

USA . 95 parts In-Stock

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$17.503

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$16.103

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95

$17.503

$16.103

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ChromeModa Solutions

Germany . 4,142 parts In-Stock

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$17.860

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$14.645

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

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$17.860

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$16.967

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$16.074

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One Stop Electronics

USA . 1,222 parts In-Stock

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$18.000

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Andel Nordic

Denmark . 307 parts In-Stock

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$113.308

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$108.775

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$108.775

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$108.775

Microchip USA

USA . 5,953 parts In-Stock

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Northwest PG Solutions

USA . 1,474 parts In-Stock

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Corphita

USA . 1,362 parts In-Stock

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Overview

Enhance the efficiency and reliability of your electronic designs with the Texas Instruments 74GTLPH16912VRE4 Bus Driver & Transceivers. Crafted by a trusted manufacturer, this product ensures top-notch quality and performance. Ideal for applications requiring seamless data transmission, this component boasts a compact design and advanced technology, making it a valuable asset for your projects. Trust in Texas Instruments to deliver innovative solutions that exceed expectations and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it ideal for use in buses where weight is a concern.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures efficient power consumption, making it suitable for energy-efficient bus systems.

Propagation Delay (tpd): 6.5 ns

The low propagation delay of 6.5 ns allows for high-speed data transmission, ensuring reliable communication between components in the bus system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions typically found in bus systems.

Technology: BICMOS

The use of BICMOS technology offers a combination of bipolar and CMOS technologies, providing high speed and low power consumption, making it an efficient choice for bus systems.

Technical Specifications

Bus Driver & Transceivers 74GTLPH16912VRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PDSO-G56

Length:

11.3 mm

Maximum I (ol):

50 Amp

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTL/P & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74GTLPH16912VRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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